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XS1-L16A-128-QF124-C10

XS1-L16A-128-QF124-C10

Manufacturer No:

XS1-L16A-128-QF124-C10

Manufacturer:

XMOS

Description:

IC MCU 32BIT 128KB SRAM 124QFN

Datasheet:

Datasheet

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XS1-L16A-128-QF124-C10 Specifications

  • Type
    Parameter
  • Supplier Device Package
    124-QFN DualRow (10x10)
  • Package / Case
    124-TFQFN Dual Rows, Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Oscillator Type
    External
  • Data Converters
    -
  • Voltage - Supply (Vcc/Vdd)
    0.95V ~ 3.6V
  • RAM Size
    -
  • EEPROM Size
    -
  • Program Memory Type
    SRAM
  • Program Memory Size
    128KB (32K x 32)
  • Number of I/O
    84
  • Peripherals
    -
  • Connectivity
    Configurable
  • Speed
    1000MIPS
  • Core Size
    32-Bit 16-Core
  • Core Processor
    XCore
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    XS1
The XS1-L16A-128-QF124-C10 is an integrated circuit chip developed by XMOS. It belongs to the XS1-L series of multicore microcontrollers and offers several advantages and application scenarios:Advantages: 1. Multicore Architecture: The XS1-L16A-128-QF124-C10 chip features 16 high-performance 32-bit processor cores, allowing for parallel processing and efficient execution of complex tasks. 2. Low Latency: It provides low-latency inter-core communication, enabling real-time processing and synchronization of multiple tasks. 3. Flexible I/O: The chip offers a wide range of I/O options, including digital I/O, analog inputs, and various communication interfaces, making it suitable for diverse applications. 4. High-Speed Connectivity: It supports high-speed USB, Ethernet, and other communication protocols, facilitating connectivity with external devices and networks. 5. Low Power Consumption: The XS1-L16A-128-QF124-C10 chip is designed to be power-efficient, making it suitable for battery-powered or energy-conscious applications. 6. Scalability: It allows for easy scalability, enabling the addition of more chips or modules to expand processing capabilities.Application Scenarios: 1. Audio Processing: The XS1-L16A-128-QF124-C10 chip is commonly used in audio applications, such as audio mixing consoles, digital audio workstations, and audio effects processors. Its multicore architecture and low latency make it ideal for real-time audio processing. 2. Robotics and Automation: The chip's parallel processing capabilities and flexible I/O options make it suitable for robotics and automation applications. It can handle multiple tasks simultaneously, such as sensor data processing, motor control, and communication with external devices. 3. Industrial Control Systems: The XS1-L16A-128-QF124-C10 chip can be used in industrial control systems, such as programmable logic controllers (PLCs) and distributed control systems (DCS). Its high-speed connectivity and low latency enable efficient control and monitoring of industrial processes. 4. Internet of Things (IoT): With its low power consumption and connectivity options, the chip can be utilized in IoT devices, including smart home automation systems, environmental monitoring sensors, and wearable devices. 5. Signal Processing: The XS1-L16A-128-QF124-C10 chip is suitable for applications requiring high-performance signal processing, such as digital signal processing (DSP), image processing, and video encoding/decoding.Overall, the XS1-L16A-128-QF124-C10 chip offers a combination of processing power, low latency, and flexibility, making it well-suited for a wide range of applications requiring real-time processing, connectivity, and scalability.
XS1-L16A-128-QF124-C10 Relevant information