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CY9AF316NABGL-GE1

CY9AF316NABGL-GE1

Manufacturer No:

CY9AF316NABGL-GE1

Manufacturer:

Infineon Technologies

Description:

IC MCU 32BIT 512KB FLSH 112PFBGA

Datasheet:

Datasheet

Delivery:

Payment:

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CY9AF316NABGL-GE1 Specifications

  • Type
    Parameter
  • Supplier Device Package
    112-PFBGA (10x10)
  • Package / Case
    112-LFBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 105°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    A/D 16x12b
  • Voltage - Supply (Vcc/Vdd)
    2.7V ~ 5.5V
  • RAM Size
    32K x 8
  • EEPROM Size
    -
  • Program Memory Type
    FLASH
  • Program Memory Size
    512KB (512K x 8)
  • Number of I/O
    83
  • Peripherals
    DMA, LVD, POR, PWM, WDT
  • Connectivity
    CSIO, EBI/EMI, I²C, LINbus, UART/USART, USB
  • Speed
    40MHz
  • Core Size
    32-Bit Single-Core
  • Core Processor
    ARM® Cortex®-M3
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    FM3 MB9A310A
The CY9AF316NABGL-GE1 is a specific model of the integrated circuit (IC) chip manufactured by Cypress Semiconductor. Unfortunately, there is limited information available specifically about this particular chip. However, I can provide you with general information about IC chips and their advantages and application scenarios.Advantages of IC chips in general: 1. Compactness: IC chips are incredibly small and compact, allowing for high levels of integration and miniaturization in electronic devices. 2. Reliability: The integration of multiple components onto a single chip reduces the number of interconnections and solder joints, thus improving reliability and reducing the chances of failure. 3. Power efficiency: IC chips are designed to consume minimal power while providing optimum performance and functionality. 4. Cost-effectiveness: Mass production and integration of various components on a single chip lead to cost savings. 5. Performance: IC chips can offer high-speed operation, low latency, and improved functionality compared to discrete components.Application scenarios of IC chips: 1. Telecommunications: IC chips are extensively used in telecommunications equipment such as routers, switches, and modems, providing high-speed data transfer, networking, and wireless connectivity. 2. Consumer electronics: IC chips form the backbone of various consumer devices like smartphones, tablets, laptops, digital cameras, and audio/video equipment, enabling advanced functionality, processing power, and energy efficiency. 3. Automotive: IC chips are used in automotive applications such as engine control units (ECUs), advanced driver-assistance systems (ADAS), infotainment systems, and sensor interfaces, enhancing safety, fuel efficiency, and vehicle performance. 4. Industrial automation: IC chips play a vital role in industrial automation systems, including programmable logic controllers (PLCs), human-machine interfaces (HMIs), motor control systems, and power management, improving productivity, efficiency, and control in manufacturing processes. 5. Medical devices: IC chips are used in medical devices like pacemakers, defibrillators, digital thermometers, and imaging systems, providing accurate measurements, monitoring, and control for healthcare professionals. 6. Internet of Things (IoT): IC chips are the core components of IoT devices, enabling connectivity, data processing, and control in various applications like smart homes, wearables, environmental monitoring, and asset tracking.It is important to note that the above information is based on general knowledge of IC chip advantages and application scenarios. For specific details about the CY9AF316NABGL-GE1 chip, referring to the datasheets, technical documentation, or contacting Cypress Semiconductor's technical support might be more appropriate.
CY9AF316NABGL-GE1 Relevant information