Home / Microcontrollers / DSPIC30F1010-30I/MM/
DSPIC30F1010-30I/MM

DSPIC30F1010-30I/MM

Manufacturer No:

DSPIC30F1010-30I/MM

Manufacturer:

Microchip Technology

Description:

IC MCU 16BIT 6KB FLASH 28QFN

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

DSPIC30F1010-30I/MM Specifications

  • Type
    Parameter
  • Supplier Device Package
    28-QFN-S (6x6)
  • Package / Case
    28-VQFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    A/D 6x10b
  • Voltage - Supply (Vcc/Vdd)
    3V ~ 5.5V
  • RAM Size
    256 x 8
  • EEPROM Size
    -
  • Program Memory Type
    FLASH
  • Program Memory Size
    6KB (2K x 24)
  • Number of I/O
    21
  • Peripherals
    Brown-out Detect/Reset, POR, PWM, WDT
  • Connectivity
    I²C, IrDA, LINbus, SPI, UART/USART
  • Speed
    30 MIPs
  • Core Size
    16-Bit
  • Core Processor
    dsPIC
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    dsPIC™ 30F
The DSPIC30F1010-30I/MM integrated circuit chips have several advantages and application scenarios:Advantages: 1. High-performance Digital Signal Processor (DSP): The DSPIC30F1010-30I/MM chips are equipped with a powerful DSP core, allowing for efficient and fast signal processing tasks. 2. Enhanced Peripheral Integration: These chips offer a wide range of integrated peripherals such as analog-to-digital converters (ADCs), digital-to-analog converters (DACs), timers, and communication interfaces, reducing the need for external components. 3. Low Power Consumption: The DSPIC30F1010-30I/MM chips are designed to operate at low power, making them suitable for battery-powered applications or energy-efficient systems. 4. Flexible and Scalable: These chips provide flexibility in terms of programming and can be easily scaled up or down to meet the requirements of different applications. 5. Robust and Reliable: The DSPIC30F1010-30I/MM chips are designed to withstand harsh environments and offer high reliability, making them suitable for industrial applications.Application Scenarios: 1. Motor Control: The DSPIC30F1010-30I/MM chips are commonly used in motor control applications, such as controlling the speed and direction of motors in robotics, industrial automation, and electric vehicles. 2. Power Electronics: These chips are suitable for power electronics applications, including inverters, power supplies, and energy management systems, where precise control and efficient power conversion are required. 3. Audio Processing: The DSP capabilities of these chips make them ideal for audio processing applications, such as audio effects, equalizers, and audio synthesis. 4. Communication Systems: The integrated communication interfaces in the DSPIC30F1010-30I/MM chips enable their use in communication systems, including wireless communication, networking, and data transmission. 5. Sensor Data Processing: These chips can be used for processing data from various sensors, such as temperature sensors, pressure sensors, and accelerometers, in applications like environmental monitoring, healthcare devices, and industrial sensing.Overall, the DSPIC30F1010-30I/MM integrated circuit chips offer high-performance signal processing capabilities, integrated peripherals, low power consumption, and robustness, making them suitable for a wide range of applications in various industries.
DSPIC30F1010-30I/MM Relevant information