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DSPIC33CK512MP605T-I/M7

DSPIC33CK512MP605T-I/M7

Manufacturer No:

DSPIC33CK512MP605T-I/M7

Manufacturer:

Microchip Technology

Description:

IC MCU 16BIT 512KB FLASH 48VQFN

Datasheet:

Datasheet

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DSPIC33CK512MP605T-I/M7 Specifications

  • Type
    Parameter
  • Supplier Device Package
    48-VQFN (6x6)
  • Package / Case
    48-VFQFN Exposed Pad
  • Mounting Type
    Surface Mount, Wettable Flank
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    A/D 19x12b SAR; D/A 6x12b
  • Voltage - Supply (Vcc/Vdd)
    3V ~ 3.6V
  • RAM Size
    64K x 8
  • EEPROM Size
    -
  • Program Memory Type
    FLASH
  • Program Memory Size
    512KB (512K x 8)
  • Number of I/O
    39
  • Peripherals
    Brown-out Detect/Reset, DMA, I²S, Motor Control, POR, PWM, QEI, WDT
  • Connectivity
    CANbus, I²C, IrDA, LINbus, SPI, UART/USART
  • Speed
    100MIPs
  • Core Size
    16-Bit
  • Core Processor
    dsPIC
  • DigiKey Programmable
    Not Verified
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The DSPIC33CK512MP605T-I/M7 integrated circuit chips offer several advantages and can be applied in various scenarios. Some of the advantages and application scenarios are:Advantages: 1. High Performance: The DSPIC33CK512MP605T-I/M7 chips are based on the dsPIC33C core, which provides high performance and processing power for demanding applications. 2. Digital Signal Processing (DSP) Capabilities: These chips are specifically designed for applications that require DSP capabilities, such as audio processing, motor control, power conversion, and digital communication. 3. Integrated Peripherals: The chips come with a wide range of integrated peripherals, including multiple UART, SPI, I2C, and PWM modules, which simplify the design and reduce the need for external components. 4. Enhanced Connectivity: They offer various connectivity options, including USB, Ethernet, CAN, and LIN interfaces, enabling seamless communication with other devices or systems. 5. Low Power Consumption: The chips are designed to operate at low power, making them suitable for battery-powered applications or energy-efficient systems. 6. Robust Security Features: They provide robust security features, including hardware encryption and tamper detection, ensuring the protection of sensitive data and intellectual property.Application Scenarios: 1. Industrial Automation: The DSPIC33CK512MP605T-I/M7 chips can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication with other devices. 2. Power Electronics: They are suitable for power electronics applications, including power conversion, inverters, and motor drives, where high-performance DSP capabilities are required. 3. Audio Processing: These chips can be used in audio processing applications, such as audio effects, audio synthesis, and digital audio amplifiers. 4. Communication Systems: They can be applied in communication systems, including wireless communication, wired communication, and networked devices, due to their integrated connectivity options. 5. Automotive Electronics: The chips can be used in automotive electronics for tasks such as engine control, advanced driver assistance systems (ADAS), and infotainment systems. 6. Medical Devices: They are suitable for medical devices that require high-performance signal processing, such as patient monitoring systems, medical imaging, and diagnostic equipment.Overall, the DSPIC33CK512MP605T-I/M7 integrated circuit chips offer high performance, DSP capabilities, integrated peripherals, connectivity options, low power consumption, and security features, making them versatile for a wide range of applications in various industries.
DSPIC33CK512MP605T-I/M7 Relevant information