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SPC5775BDK3MME2

SPC5775BDK3MME2

Manufacturer No:

SPC5775BDK3MME2

Manufacturer:

NXP USA Inc.

Description:

IC MCU 32BIT 4MB FLASH 416MAPBGA

Datasheet:

Datasheet

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SPC5775BDK3MME2 Specifications

  • Type
    Parameter
  • Supplier Device Package
    416-MAPBGA (27x27)
  • Package / Case
    416-BGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Oscillator Type
    External
  • Data Converters
    A/D 40x12b eQADCx2
  • Voltage - Supply (Vcc/Vdd)
    3V ~ 5.5V
  • RAM Size
    512K x 8
  • EEPROM Size
    -
  • Program Memory Type
    FLASH
  • Program Memory Size
    4MB (4M x 8)
  • Number of I/O
    293
  • Peripherals
    DMA, LVD, POR, Zipwire
  • Connectivity
    CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
  • Speed
    220MHz
  • Core Size
    32-Bit Dual-Core
  • Core Processor
    e200z7
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    MPC57xx
The SPC5775BDK3MME2 integrated circuit chips have several advantages and application scenarios. Here are some of them:Advantages: 1. High Performance: The SPC5775BDK3MME2 chips are designed to deliver high performance with a powerful 32-bit Power Architecture? e200z7 core running at up to 300 MHz. This makes them suitable for demanding applications that require fast processing capabilities.2. Enhanced Safety and Security: These chips come with built-in safety and security features, including hardware security modules (HSMs) and memory protection units (MPUs). This ensures the integrity and confidentiality of data, making them ideal for applications that require high levels of safety and security, such as automotive systems.3. Connectivity Options: The SPC5775BDK3MME2 chips offer various connectivity options, including Ethernet, CAN, LIN, and FlexRay interfaces. This enables seamless integration with different communication protocols, making them suitable for applications that require connectivity and communication capabilities.4. Rich Peripherals: These chips come with a wide range of peripherals, such as ADCs, PWMs, timers, and serial interfaces. This allows for easy integration with external devices and sensors, making them suitable for applications that require control and monitoring of various peripherals.Application Scenarios: 1. Automotive Systems: The SPC5775BDK3MME2 chips are commonly used in automotive systems, such as advanced driver-assistance systems (ADAS), engine control units (ECUs), and body control modules (BCMs). Their high performance, safety features, and connectivity options make them suitable for these applications.2. Industrial Automation: These chips can be used in industrial automation systems, such as programmable logic controllers (PLCs) and robotics. Their high performance and rich peripherals enable efficient control and monitoring of industrial processes.3. Internet of Things (IoT): The SPC5775BDK3MME2 chips can be utilized in IoT applications that require connectivity and processing capabilities. They can be used in smart home devices, industrial IoT solutions, and other IoT-enabled systems.4. Medical Devices: These chips can be employed in medical devices, such as patient monitoring systems and medical imaging equipment. Their high performance and safety features ensure accurate and reliable data processing in critical medical applications.Overall, the SPC5775BDK3MME2 integrated circuit chips offer high performance, safety features, connectivity options, and rich peripherals, making them suitable for a wide range of applications in automotive, industrial, IoT, and medical domains.
SPC5775BDK3MME2 Relevant information