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DSPIC33FJ64GP706-I/PT

DSPIC33FJ64GP706-I/PT

Manufacturer No:

DSPIC33FJ64GP706-I/PT

Manufacturer:

Microchip Technology

Description:

IC MCU 16BIT 64KB FLASH 64TQFP

Datasheet:

Datasheet

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DSPIC33FJ64GP706-I/PT Specifications

  • Type
    Parameter
  • Supplier Device Package
    64-TQFP (10x10)
  • Package / Case
    64-TQFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    A/D 18x10b/12b
  • Voltage - Supply (Vcc/Vdd)
    3V ~ 3.6V
  • RAM Size
    16K x 8
  • EEPROM Size
    -
  • Program Memory Type
    FLASH
  • Program Memory Size
    64KB (64K x 8)
  • Number of I/O
    53
  • Peripherals
    AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
  • Connectivity
    CANbus, I²C, IrDA, LINbus, SPI, UART/USART
  • Speed
    40 MIPs
  • Core Size
    16-Bit
  • Core Processor
    dsPIC
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    dsPIC™ 33F
The DSPIC33FJ64GP706-I/PT integrated circuit chips have several advantages and application scenarios:Advantages: 1. High-performance: These chips are based on the dsPIC33F core, which offers high computational performance and efficient instruction execution. 2. Digital Signal Processing (DSP) capabilities: The chips have a wide range of DSP instructions and peripherals, making them suitable for applications that require real-time signal processing. 3. Enhanced connectivity: They feature various communication interfaces like UART, SPI, I2C, and USB, enabling seamless connectivity with other devices. 4. Rich set of peripherals: The chips come with a variety of peripherals such as timers, PWM modules, ADCs, and DACs, allowing for versatile application development. 5. Low power consumption: They are designed to operate at low power, making them suitable for battery-powered applications. 6. Robust and reliable: These chips are built with advanced technology, ensuring high reliability and robustness.Application scenarios: 1. Motor control: The DSPIC33FJ64GP706-I/PT chips are commonly used in motor control applications, such as industrial automation, robotics, and electric vehicles. Their high-performance DSP capabilities and PWM modules make them ideal for precise motor control. 2. Power electronics: These chips can be used in power electronics applications like inverters, power supplies, and energy management systems. Their high computational power and communication interfaces enable efficient control and monitoring of power systems. 3. Audio processing: The DSP capabilities of these chips make them suitable for audio processing applications like audio effects, equalizers, and audio synthesis. 4. Communication systems: The integrated communication interfaces of these chips make them suitable for applications like data communication, networking, and wireless communication systems. 5. Sensor interfacing: The chips' ADC modules and communication interfaces make them suitable for interfacing with various sensors, such as temperature sensors, pressure sensors, and accelerometers.Overall, the DSPIC33FJ64GP706-I/PT integrated circuit chips offer high-performance DSP capabilities, enhanced connectivity, and a rich set of peripherals, making them suitable for a wide range of applications requiring real-time signal processing and control.
DSPIC33FJ64GP706-I/PT Relevant information