DSPIC30F3013-30I/SO
Manufacturer No:
DSPIC30F3013-30I/SO
Manufacturer:
Description:
IC MCU 16BIT 24KB FLASH 28SOIC
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In Stock : 1305
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DSPIC30F3013-30I/SO Specifications
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TypeParameter
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Supplier Device Package28-SOIC
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Package / Case28-SOIC (0.295", 7.50mm Width)
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C (TA)
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Oscillator TypeInternal
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Data ConvertersA/D 10x12b
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Voltage - Supply (Vcc/Vdd)2.5V ~ 5.5V
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RAM Size2K x 8
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EEPROM Size1K x 8
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Program Memory TypeFLASH
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Program Memory Size24KB (8K x 24)
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Number of I/O20
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PeripheralsBrown-out Detect/Reset, POR, PWM, WDT
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ConnectivityI²C, SPI, UART/USART
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Speed30 MIPs
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Core Size16-Bit
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Core ProcessordsPIC
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DigiKey ProgrammableVerified
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PackagingTube
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Product StatusActive
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SeriesdsPIC™ 30F
The DSPIC30F3013-30I/SO integrated circuit chips have several advantages and application scenarios, including:Advantages: 1. High-performance DSP Core: The DSPIC30F3013-30I/SO chips feature a high-performance core that is specifically designed for digital signal processing applications. This allows for efficient and rapid processing of complex algorithms and tasks. 2. Enhanced Peripheral Integration: These chips come with various integrated peripherals and interfaces, such as ADCs, PWM modules, UARTs, timers, and communication interfaces like SPI and I2C. This integration reduces the need for external components and simplifies the overall design. 3. Low-Power Operation: The DSPIC30F3013-30I/SO chips are designed to operate at low power levels, making them suitable for power-sensitive applications. They offer multiple power-saving modes, including sleep and idle modes, to conserve energy and extend battery life. 4. Extensive Memory Options: These chips have a range of memory options, including Flash program memory, RAM, and EEPROM. This enables the storage of program code, data, and configuration settings on the chip itself, eliminating the need for external memory devices. 5. Wide Operating Voltage Range: The DSPIC30F3013-30I/SO chips can operate over a wide voltage range, typically from 2.5V to 5.5V. This flexibility allows them to be used in various applications with different power supply requirements.Application Scenarios: 1. Digital Signal Processing (DSP) Applications: The DSPIC30F3013-30I/SO chips are specifically designed for DSP applications, such as audio processing, motor control, power electronics, and sensor signal processing. Their high-performance DSP core and integrated peripherals make them ideal for these tasks. 2. Industrial Automation: These chips can be used in industrial automation systems for tasks such as process control, motion control, and machine vision. The integrated peripherals and communication interfaces allow seamless integration with various sensors, actuators, and communication networks. 3. Consumer Electronics: The DSPIC30F3013-30I/SO chips can be found in consumer electronics products like home appliances, multimedia systems, and automotive applications. They can be used for tasks such as audio processing, touch control, display drivers, and motor control. 4. Medical Devices: These chips are suitable for medical devices, such as diagnostic equipment, patient monitoring systems, and medical imaging devices. Their high-performance DSP capabilities can be utilized for real-time signal processing, image reconstruction, and filtering. 5. Energy Management: The DSPIC30F3013-30I/SO chips can be employed in energy management systems like solar inverters, power converters, and battery management systems. The integrated peripherals and efficient power-saving modes allow for precise control and monitoring of energy generation, storage, and distribution.Overall, the DSPIC30F3013-30I/SO integrated circuit chips offer high-performance DSP capabilities, extensive peripheral integration, low-power operation, and wide application versatility, making them suitable for a range of embedded systems and digital signal processing applications.
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