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DSPIC30F3012-30I/SO

DSPIC30F3012-30I/SO

Manufacturer No:

DSPIC30F3012-30I/SO

Manufacturer:

Microchip Technology

Description:

IC MCU 16BIT 24KB FLASH 18SOIC

Datasheet:

Datasheet

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DSPIC30F3012-30I/SO Specifications

  • Type
    Parameter
  • Supplier Device Package
    18-SOIC
  • Package / Case
    18-SOIC (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    A/D 8x12b
  • Voltage - Supply (Vcc/Vdd)
    2.5V ~ 5.5V
  • RAM Size
    2K x 8
  • EEPROM Size
    1K x 8
  • Program Memory Type
    FLASH
  • Program Memory Size
    24KB (8K x 24)
  • Number of I/O
    12
  • Peripherals
    Brown-out Detect/Reset, POR, PWM, WDT
  • Connectivity
    I²C, SPI, UART/USART
  • Speed
    30 MIPs
  • Core Size
    16-Bit
  • Core Processor
    dsPIC
  • DigiKey Programmable
    Verified
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    dsPIC™ 30F
The DSPIC30F3012-30I/SO integrated circuit chips have several advantages and application scenarios:Advantages: 1. High-performance Digital Signal Processor (DSP): The DSPIC30F3012-30I/SO chips are equipped with a powerful DSP core, allowing for efficient and fast signal processing tasks. 2. Enhanced Peripheral Integration: These chips offer a wide range of integrated peripherals such as analog-to-digital converters (ADCs), digital-to-analog converters (DACs), timers, UARTs, SPI, I2C, and more. This integration reduces the need for external components and simplifies the overall system design. 3. Low Power Consumption: The DSPIC30F3012-30I/SO chips are designed to operate at low power, making them suitable for battery-powered applications or devices with power constraints. 4. Ample Memory: These chips have a significant amount of Flash program memory and RAM, allowing for the implementation of complex algorithms and data storage. 5. Robust Communication Interfaces: The chips support various communication interfaces like UART, SPI, I2C, CAN, USB, etc., enabling seamless connectivity with other devices or systems.Application Scenarios: 1. Motor Control: The DSPIC30F3012-30I/SO chips are commonly used in motor control applications, such as controlling the speed and direction of motors in robotics, industrial automation, and electric vehicles. 2. Power Electronics: These chips find applications in power electronics systems, including inverters, power supplies, and energy management systems, where they can perform tasks like power factor correction, voltage regulation, and control. 3. Audio Processing: The DSP capabilities of these chips make them suitable for audio processing applications, such as audio effects, equalizers, audio synthesis, and digital audio amplifiers. 4. Industrial Automation: The integrated peripherals and DSP capabilities of these chips make them ideal for various industrial automation applications, including process control, data acquisition, and monitoring systems. 5. Medical Devices: The DSPIC30F3012-30I/SO chips can be used in medical devices like patient monitoring systems, medical imaging, and diagnostic equipment, where real-time signal processing and low power consumption are crucial. 6. Automotive Electronics: These chips are also used in automotive electronics applications, such as engine control units (ECUs), dashboard systems, and advanced driver-assistance systems (ADAS).Overall, the DSPIC30F3012-30I/SO chips offer high-performance signal processing capabilities, integrated peripherals, low power consumption, and ample memory, making them suitable for a wide range of applications in various industries.
DSPIC30F3012-30I/SO Relevant information