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BCM3384DUIFSBGB0T

BCM3384DUIFSBGB0T

Manufacturer No:

BCM3384DUIFSBGB0T

Manufacturer:

Broadcom Limited

Description:

CABLE MODEM

Datasheet:

Datasheet

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BCM3384DUIFSBGB0T Specifications

  • Type
    Parameter
  • Supplier Device Package
    -
  • Package / Case
    -
  • Operating Temperature
    -
  • Primary Attributes
    -
  • Speed
    -
  • Connectivity
    -
  • Peripherals
    -
  • RAM Size
    -
  • Flash Size
    -
  • Core Processor
    -
  • Architecture
    -
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    *
The MPC8547VTATGD557 is a specific model of the PowerQUICC III integrated circuit chip developed by NXP Semiconductors. This chip is designed for networking and communication applications and offers several advantages and application scenarios:1. High Performance: The MPC8547VTATGD557 chip is built on the Power Architecture technology and offers a high-performance 32-bit e500v2 core running at up to 1.3 GHz. This makes it suitable for demanding networking tasks that require fast processing speeds.2. Networking Capabilities: The chip includes integrated networking features such as Gigabit Ethernet controllers, USB ports, and Serial RapidIO interfaces. These capabilities make it ideal for applications that require network connectivity, such as routers, switches, and network appliances.3. Security Features: The MPC8547VTATGD557 chip incorporates hardware acceleration for encryption and decryption algorithms, including AES, DES, and 3DES. This enables secure communication and data transfer, making it suitable for applications that require robust security measures, such as VPN gateways or firewalls.4. Scalability: The PowerQUICC III architecture allows for scalability, enabling the chip to be used in a wide range of applications. It supports various memory configurations, including DDR2 and DDR3, and offers multiple peripheral interfaces, allowing for flexible system design.5. Industrial Applications: The MPC8547VTATGD557 chip is designed to operate in harsh industrial environments. It has a wide temperature range and supports extended temperature options, making it suitable for applications in industrial automation, transportation, and other rugged environments.6. Embedded Systems: The chip's high-performance processing capabilities and networking features make it suitable for embedded systems applications. It can be used in various embedded systems, including network appliances, industrial control systems, and embedded computing platforms.Overall, the MPC8547VTATGD557 integrated circuit chip offers high performance, networking capabilities, security features, scalability, and suitability for industrial and embedded applications.
BCM3384DUIFSBGB0T Relevant information