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XCZU3EG-3SFVC784E

XCZU3EG-3SFVC784E

Manufacturer No:

XCZU3EG-3SFVC784E

Manufacturer:

AMD

Description:

IC SOC CORTEX-A53 784FCBGA

Datasheet:

Datasheet

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XCZU3EG-3SFVC784E Specifications

  • Type
    Parameter
  • Supplier Device Package
    784-FCBGA (23x23)
  • Package / Case
    784-BFBGA, FCBGA
  • Operating Temperature
    0°C ~ 100°C (TJ)
  • Primary Attributes
    Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
  • Speed
    600MHz, 667MHz, 1.5GHz
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Peripherals
    DMA, WDT
  • RAM Size
    256KB
  • Flash Size
    -
  • Core Processor
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Architecture
    MCU, FPGA
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    Zynq® UltraScale+™ MPSoC EG
The HD63B03XPJ is a microprocessor integrated circuit chip that offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the HD63B03XPJ are:Advantages: 1. High Performance: The HD63B03XPJ is a 8-bit microprocessor chip that operates at a clock frequency of up to 3 MHz, providing high processing power for various applications. 2. Enhanced Instruction Set: It features an extended instruction set, including additional arithmetic, logical, and bit manipulation instructions, which allows for efficient programming and execution of complex tasks. 3. On-Chip Peripherals: The chip includes various on-chip peripherals such as timers, interrupt controllers, and serial communication interfaces, reducing the need for external components and simplifying system design. 4. Low Power Consumption: The HD63B03XPJ is designed to operate at low power, making it suitable for battery-powered devices or applications where power efficiency is crucial. 5. Wide Operating Voltage Range: It can operate within a wide voltage range, typically from 2.7V to 5.5V, providing flexibility in different power supply scenarios.Application Scenarios: 1. Embedded Systems: The HD63B03XPJ can be used in various embedded systems applications, such as industrial control systems, home automation, and automotive electronics, where its high performance and on-chip peripherals can be utilized. 2. Consumer Electronics: It can be employed in consumer electronics devices like gaming consoles, digital cameras, or audio players, where its processing power and low power consumption are beneficial. 3. Communication Systems: The chip can be utilized in communication systems, including modems, routers, or wireless devices, where its serial communication interfaces and processing capabilities can handle data transmission and protocol handling. 4. Instrumentation and Measurement: The HD63B03XPJ can be used in instrumentation and measurement equipment, such as data loggers, multimeters, or oscilloscopes, where its high performance and extended instruction set can process and analyze data efficiently. 5. Medical Devices: It can be applied in medical devices like patient monitors, infusion pumps, or diagnostic equipment, where its low power consumption and processing capabilities are essential for reliable and efficient operation.Overall, the HD63B03XPJ integrated circuit chip offers advantages in terms of performance, power consumption, and on-chip peripherals, making it suitable for a wide range of applications in various industries.
XCZU3EG-3SFVC784E Relevant information