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XCZU2EG-3SFVC784E

XCZU2EG-3SFVC784E

Manufacturer No:

XCZU2EG-3SFVC784E

Manufacturer:

AMD

Description:

IC SOC CORTEX-A53 784FCBGA

Datasheet:

Datasheet

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XCZU2EG-3SFVC784E Specifications

  • Type
    Parameter
  • Supplier Device Package
    784-FCBGA (23x23)
  • Package / Case
    784-BFBGA, FCBGA
  • Operating Temperature
    0°C ~ 100°C (TJ)
  • Primary Attributes
    Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
  • Speed
    600MHz, 667MHz, 1.5GHz
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Peripherals
    DMA, WDT
  • RAM Size
    256KB
  • Flash Size
    -
  • Core Processor
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Architecture
    MCU, FPGA
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    Zynq® UltraScale+™ MPSoC EG
The HD64F3687FPJE is a microcontroller integrated circuit chip developed by Renesas Electronics. It belongs to the H8S family of microcontrollers and offers several advantages and application scenarios. Some of them include:1. High-performance: The HD64F3687FPJE chip is built with a high-performance H8S/3600 CPU core, which provides fast processing capabilities. It operates at a clock frequency of up to 20 MHz, enabling efficient execution of complex tasks.2. Rich peripheral set: This microcontroller chip offers a wide range of integrated peripherals, including timers, serial interfaces, analog-to-digital converters, pulse width modulation (PWM) channels, and more. These peripherals enhance the chip's versatility and make it suitable for various applications.3. Ample memory: The HD64F3687FPJE chip features a large on-chip memory, including 60 KB of flash memory for program storage and 2 KB of RAM for data storage. This memory capacity allows for the implementation of complex algorithms and data-intensive applications.4. Low power consumption: The chip is designed to operate at low power, making it suitable for battery-powered devices or applications where power efficiency is crucial. It incorporates power-saving modes and features that help reduce overall power consumption.5. Industrial-grade reliability: The HD64F3687FPJE chip is designed to meet industrial-grade requirements, ensuring high reliability and robustness. It can withstand harsh environmental conditions, making it suitable for applications in industrial automation, control systems, and automotive electronics.Application scenarios for the HD64F3687FPJE chip include:1. Industrial automation: The chip's high-performance CPU, rich peripheral set, and industrial-grade reliability make it suitable for various industrial automation applications. It can be used in programmable logic controllers (PLCs), motor control systems, and monitoring devices.2. Automotive electronics: With its robustness and low power consumption, the chip can be used in automotive applications such as engine control units (ECUs), body control modules (BCMs), and dashboard systems. It can handle real-time control tasks and interface with various automotive sensors and actuators.3. Consumer electronics: The HD64F3687FPJE chip can be utilized in consumer electronics devices that require high processing power and memory capacity. It can be used in home appliances, audio/video equipment, and gaming consoles.4. Medical devices: The chip's reliability and processing capabilities make it suitable for medical devices such as patient monitoring systems, diagnostic equipment, and medical imaging devices.5. Communication systems: The chip's integrated serial interfaces and processing power make it suitable for communication systems, including network routers, modems, and data loggers.Overall, the HD64F3687FPJE chip offers a combination of high performance, rich peripherals, and industrial-grade reliability, making it suitable for a wide range of applications in various industries.
XCZU2EG-3SFVC784E Relevant information