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XCZU2EG-3SFVA625E

XCZU2EG-3SFVA625E

Manufacturer No:

XCZU2EG-3SFVA625E

Manufacturer:

AMD

Description:

IC SOC CORTEX-A53 625FCBGA

Datasheet:

Datasheet

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XCZU2EG-3SFVA625E Specifications

  • Type
    Parameter
  • Supplier Device Package
    625-FCBGA (21x21)
  • Package / Case
    625-BFBGA, FCBGA
  • Operating Temperature
    0°C ~ 100°C (TJ)
  • Primary Attributes
    Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
  • Speed
    600MHz, 667MHz, 1.5GHz
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Peripherals
    DMA, WDT
  • RAM Size
    256KB
  • Flash Size
    -
  • Core Processor
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Architecture
    MCU, FPGA
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    Zynq® UltraScale+™ MPSoC EG
The AM1707BZKBA3 is an integrated circuit chip developed by Texas Instruments. It is a high-performance microprocessor specifically designed for embedded applications. Some of the advantages and application scenarios of the AM1707BZKBA3 are:1. High Performance: The AM1707BZKBA3 chip is based on the ARM Cortex-A8 core, which provides high processing power and performance. It operates at a clock speed of up to 600 MHz, making it suitable for demanding applications.2. Low Power Consumption: Despite its high performance, the AM1707BZKBA3 chip is designed to be power-efficient. It incorporates power management techniques to minimize power consumption, making it suitable for battery-powered or energy-efficient devices.3. Connectivity Options: The chip offers various connectivity options, including USB, Ethernet, UART, SPI, I2C, and more. This makes it suitable for applications that require communication with other devices or networks.4. Multimedia Capabilities: The AM1707BZKBA3 chip includes a dedicated hardware accelerator for video and image processing. It supports various multimedia codecs, making it suitable for applications involving multimedia playback or processing.5. Industrial Applications: The chip is designed to meet the requirements of industrial applications. It offers features like extended temperature range, industrial-grade peripherals, and robustness to withstand harsh environments.6. Embedded Systems: The AM1707BZKBA3 chip is commonly used in embedded systems, such as industrial automation, robotics, medical devices, automotive systems, and more. Its high performance, connectivity options, and multimedia capabilities make it suitable for a wide range of embedded applications.7. Internet of Things (IoT): With its low power consumption and connectivity options, the chip can be used in IoT devices. It can serve as a central processing unit for IoT gateways, edge devices, or smart home automation systems.8. Real-Time Applications: The AM1707BZKBA3 chip supports real-time operating systems (RTOS) and offers features like interrupt handling, timers, and watchdogs. This makes it suitable for real-time applications that require precise timing and responsiveness.Overall, the AM1707BZKBA3 chip offers a combination of high performance, low power consumption, connectivity options, and multimedia capabilities, making it suitable for a wide range of embedded applications, industrial systems, IoT devices, and real-time applications.
XCZU2EG-3SFVA625E Relevant information