A2F200M3F-PQG208
Manufacturer No:
A2F200M3F-PQG208
Manufacturer:
Description:
IC SOC CORTEX-M3 80MHZ 208QFP
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A2F200M3F-PQG208 Specifications
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TypeParameter
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Supplier Device Package208-PQFP (28x28)
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Package / Case208-BFQFP
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Operating Temperature0°C ~ 85°C (TJ)
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Primary AttributesProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
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Speed80MHz
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ConnectivityEBI/EMI, Ethernet, I²C, SPI, UART/USART
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PeripheralsDMA, POR, WDT
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RAM Size64KB
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Flash Size256KB
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Core ProcessorARM® Cortex®-M3
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ArchitectureMCU, FPGA
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PackagingTray
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Product StatusActive
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SeriesSmartFusion®
The OMAP3503ECBCA integrated circuit chips, developed by Texas Instruments, have several advantages and application scenarios. Some of them include:1. High Performance: The OMAP3503ECBCA chips are designed to deliver high performance with a clock speed of up to 600 MHz. This makes them suitable for applications that require fast processing and multitasking capabilities.2. Low Power Consumption: These chips are optimized for low power consumption, making them ideal for battery-powered devices such as smartphones, tablets, and portable media players. They offer a balance between performance and power efficiency.3. Multimedia Capabilities: The OMAP3503ECBCA chips come with integrated multimedia accelerators, including a dedicated graphics engine and video processing unit. This enables them to handle multimedia tasks such as video playback, image processing, and 3D graphics rendering efficiently.4. Connectivity Options: These chips support various connectivity options, including USB, Ethernet, and multiple serial interfaces. This makes them suitable for applications that require connectivity to external devices or networks.5. Application Scenarios: The OMAP3503ECBCA chips find applications in a wide range of devices, including smartphones, tablets, portable media players, digital cameras, and industrial control systems. They are also used in automotive infotainment systems, medical devices, and home automation systems.Overall, the OMAP3503ECBCA integrated circuit chips offer a combination of high performance, low power consumption, multimedia capabilities, and connectivity options, making them suitable for a diverse range of applications.
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