1SX280HH2F55I2VG

1SX280HH2F55I2VG

Manufacturer No:

1SX280HH2F55I2VG

Manufacturer:

Intel

Description:

IC FPGA STRATIX 10 2912FBGA

Datasheet:

Datasheet

Delivery:

Payment:

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1SX280HH2F55I2VG Specifications

  • Type
    Parameter
  • Flash Size
    256KB
  • Architecture
    MCU, FPGA
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Stratix® 10 SX
The MPC875VR133 is a specific model of integrated circuit chip manufactured by Freescale Semiconductor (now NXP Semiconductors). It is a PowerQUICC II Pro processor, which is designed for embedded applications and networking systems. Here are some advantages and application scenarios of the MPC875VR133:Advantages: 1. High Performance: The MPC875VR133 is based on the PowerPC architecture and offers a clock speed of 133 MHz, providing high processing power for demanding applications. 2. Integrated Features: It integrates various peripherals like Ethernet controllers, UARTs, timers, and memory controllers, reducing the need for additional external components. 3. Low Power Consumption: The chip is designed to operate efficiently with low power consumption, making it suitable for battery-powered devices or systems with power constraints. 4. Scalability: The PowerQUICC II Pro architecture allows for scalability, enabling the chip to be used in a wide range of applications with varying performance requirements.Application Scenarios: 1. Networking Equipment: The MPC875VR133 is commonly used in networking equipment such as routers, switches, and gateways. Its high performance and integrated networking features make it suitable for handling data processing and communication tasks in these devices. 2. Industrial Automation: The chip can be utilized in industrial automation systems for tasks like control, monitoring, and communication. Its low power consumption and scalability make it suitable for various industrial applications. 3. Embedded Systems: The MPC875VR133 can be used in embedded systems for applications like automotive electronics, medical devices, and consumer electronics. Its high performance and integrated features make it suitable for running complex software and handling data processing tasks. 4. Communication Systems: The chip can be employed in communication systems like base stations, wireless access points, and telecommunication infrastructure. Its networking capabilities and scalability make it suitable for handling communication protocols and data processing in these systems.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and use cases of the system being developed.