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1SX250HU3F50E2LG

1SX250HU3F50E2LG

Manufacturer No:

1SX250HU3F50E2LG

Manufacturer:

Intel

Description:

IC FPGA STRATIX 10 2397FBGA

Datasheet:

Datasheet

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1SX250HU3F50E2LG Specifications

  • Type
    Parameter
  • Flash Size
    256KB
  • Architecture
    MCU, FPGA
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Stratix® 10 SX
The R8A774A0HA01BG#G2 is an integrated circuit chip developed by Renesas Electronics Corporation. It is a system-on-chip (SoC) designed for automotive applications. Here are some advantages and application scenarios of this chip:Advantages: 1. High Performance: The R8A774A0HA01BG#G2 chip is built with a powerful Arm Cortex-A53 quad-core processor, providing high-performance computing capabilities for automotive applications. 2. Graphics Processing: It features a PowerVR Series8XE GPU, enabling advanced graphics processing for in-vehicle infotainment systems and instrument clusters. 3. Connectivity: The chip supports various connectivity options, including Ethernet, CAN, USB, and HDMI, allowing seamless integration with different automotive systems and devices. 4. Safety and Security: It incorporates advanced safety and security features, such as hardware-based encryption and secure boot, ensuring the protection of critical automotive data and systems. 5. Automotive-Grade: The R8A774A0HA01BG#G2 chip is designed to meet the stringent requirements of the automotive industry, including temperature, reliability, and longevity.Application Scenarios: 1. In-Vehicle Infotainment (IVI) Systems: The chip can be used in IVI systems to provide multimedia capabilities, including audio/video playback, navigation, connectivity, and advanced user interfaces. 2. Instrument Clusters: It can power instrument clusters with high-resolution displays, 3D graphics, and real-time information, enhancing the driver's experience and providing vital vehicle data. 3. Advanced Driver Assistance Systems (ADAS): The chip's computing power and connectivity options make it suitable for ADAS applications, such as camera-based object detection, lane departure warning, and collision avoidance systems. 4. Telematics: It can be utilized in automotive telematics systems to enable vehicle tracking, remote diagnostics, over-the-air updates, and connectivity with external services. 5. Gateway Modules: The chip's connectivity features make it suitable for use in automotive gateway modules, facilitating communication between different in-vehicle networks and external systems.Overall, the R8A774A0HA01BG#G2 chip offers high performance, graphics processing, connectivity, safety, and automotive-grade reliability, making it suitable for a wide range of automotive applications.
1SX250HU3F50E2LG Relevant information