1SX250HU3F50I3VG

1SX250HU3F50I3VG

Manufacturer No:

1SX250HU3F50I3VG

Manufacturer:

Intel

Description:

IC FPGA STRATIX 10 2397FBGA

Datasheet:

Datasheet

Delivery:

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1SX250HU3F50I3VG Specifications

  • Type
    Parameter
  • Flash Size
    256KB
  • Architecture
    MCU, FPGA
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Stratix® 10 SX
The S32G274AABK0CUCT integrated circuit (IC) chips, developed by NXP Semiconductors, offer several advantages and find application in various scenarios. Some of the advantages and application scenarios of these chips are:Advantages: 1. High Performance: The S32G274AABK0CUCT chips are built on Arm Cortex-A53 cores, providing high processing power and performance for demanding applications. 2. Integrated Security: These chips incorporate advanced security features, including secure boot, secure debug, and hardware encryption, ensuring the protection of sensitive data and preventing unauthorized access. 3. Automotive-Grade Reliability: The S32G274AABK0CUCT chips are designed to meet the stringent requirements of the automotive industry, offering high reliability, robustness, and long-term availability. 4. Connectivity: These chips support various communication interfaces, such as Ethernet, CAN, LIN, FlexRay, and PCIe, enabling seamless connectivity and integration with other automotive systems. 5. Functional Safety: The S32G274AABK0CUCT chips comply with ISO 26262 functional safety standards, making them suitable for safety-critical applications in the automotive domain.Application Scenarios: 1. Connected Cars: The S32G274AABK0CUCT chips are ideal for connected car applications, enabling secure and reliable communication between various vehicle systems, such as infotainment, telematics, advanced driver-assistance systems (ADAS), and vehicle-to-everything (V2X) communication. 2. Autonomous Vehicles: These chips can be used in autonomous vehicles, providing the necessary processing power, connectivity, and security features required for real-time data processing, sensor fusion, and decision-making algorithms. 3. Industrial Automation: The S32G274AABK0CUCT chips find application in industrial automation systems, enabling secure and high-performance communication between different machines, controllers, and sensors in a factory environment. 4. Smart Cities: These chips can be utilized in smart city infrastructure, facilitating secure and reliable communication between various IoT devices, sensors, and control systems, enabling efficient management of resources and services. 5. Edge Computing: The high-performance capabilities of the S32G274AABK0CUCT chips make them suitable for edge computing applications, where real-time processing and low latency are crucial, such as video analytics, machine learning, and AI inference at the edge.Overall, the S32G274AABK0CUCT chips offer a combination of high performance, connectivity, security, and functional safety, making them well-suited for a wide range of automotive and industrial applications.