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10AS027H4F35I3LG

10AS027H4F35I3LG

Manufacturer No:

10AS027H4F35I3LG

Manufacturer:

Intel

Description:

IC SOC CORTEX-A9 1.5GHZ 1152FBGA

Datasheet:

Datasheet

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Payment:

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10AS027H4F35I3LG Specifications

  • Type
    Parameter
  • Flash Size
    256KB
  • Architecture
    MCU, FPGA
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Arria 10 SX
The BCM47081SF03 integrated circuit chips, also known as system-on-a-chip (SoC) solutions, offer several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of BCM47081SF03 chips are:1. High Performance: The BCM47081SF03 chips are designed to deliver high performance with a dual-core ARM Cortex-A9 processor running at up to 1.4 GHz. This makes them suitable for applications that require fast processing and multitasking capabilities.2. Wireless Connectivity: These chips come with built-in Wi-Fi and Bluetooth capabilities, enabling seamless wireless connectivity. This makes them ideal for applications that require internet connectivity, such as smart home devices, IoT devices, and wireless routers.3. Multimedia Support: BCM47081SF03 chips feature a powerful graphics processing unit (GPU) that supports high-definition video decoding and encoding. This makes them suitable for multimedia applications like streaming devices, media players, and smart TVs.4. Security Features: These chips incorporate advanced security features like hardware acceleration for encryption and decryption, secure boot, and secure storage. This makes them suitable for applications that require secure data transmission and storage, such as network gateways and security systems.5. IoT Applications: The BCM47081SF03 chips are well-suited for Internet of Things (IoT) applications due to their low power consumption, wireless connectivity, and processing capabilities. They can be used in smart home automation, industrial automation, and other IoT devices.6. Network Infrastructure: These chips can be used in network infrastructure devices like routers, access points, and switches. Their high-performance processing capabilities and wireless connectivity make them suitable for handling network traffic and managing multiple devices.7. Smart City Applications: BCM47081SF03 chips can be applied in smart city solutions, such as intelligent transportation systems, smart lighting, and environmental monitoring. Their wireless connectivity and processing power enable efficient data collection, analysis, and control in smart city deployments.Overall, the BCM47081SF03 integrated circuit chips offer a combination of high performance, wireless connectivity, multimedia support, and security features, making them versatile for a wide range of applications in various industries.
10AS027H4F35I3LG Relevant information