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10AS032E4F29I3LG

10AS032E4F29I3LG

Manufacturer No:

10AS032E4F29I3LG

Manufacturer:

Intel

Description:

IC SOC CORTEX-A9 1.5GHZ 780FBGA

Datasheet:

Datasheet

Delivery:

Payment:

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10AS032E4F29I3LG Specifications

  • Type
    Parameter
  • Flash Size
    256KB
  • Architecture
    MCU, FPGA
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Arria 10 SX
The BCM47083SB03 integrated circuit (IC) chips, developed by Broadcom, offer several advantages and find application in various scenarios. Some of the advantages and application scenarios of these chips are:Advantages: 1. High Performance: The BCM47083SB03 chips provide high-performance processing capabilities, enabling efficient and fast data processing. 2. Dual-Band Wi-Fi: These chips support dual-band Wi-Fi (2.4 GHz and 5 GHz), allowing for faster wireless connectivity and better network performance. 3. Integrated Bluetooth: The chips come with integrated Bluetooth functionality, enabling seamless connectivity with Bluetooth-enabled devices. 4. Low Power Consumption: BCM47083SB03 chips are designed to be power-efficient, ensuring longer battery life for devices that incorporate these chips. 5. Security Features: These chips offer advanced security features, including encryption and authentication protocols, to ensure secure data transmission and protection against cyber threats.Application Scenarios: 1. Wireless Routers: The BCM47083SB03 chips are commonly used in wireless routers to provide high-speed internet connectivity and reliable wireless networking. 2. Smart Home Devices: These chips can be integrated into smart home devices such as smart speakers, smart thermostats, and smart security systems, enabling wireless connectivity and control. 3. Internet of Things (IoT) Devices: BCM47083SB03 chips find application in various IoT devices, including wearables, home automation systems, and industrial IoT devices, enabling wireless connectivity and data processing. 4. Streaming Devices: These chips can be used in streaming devices like media players and smart TVs, providing fast and reliable Wi-Fi connectivity for streaming high-definition content. 5. Enterprise Networking: BCM47083SB03 chips are suitable for enterprise networking equipment, such as access points and switches, offering high-performance wireless connectivity and network management capabilities.Overall, the BCM47083SB03 integrated circuit chips offer high performance, dual-band Wi-Fi, low power consumption, and security features, making them suitable for a wide range of applications in wireless networking, smart devices, IoT, and enterprise networking.
10AS032E4F29I3LG Relevant information