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10AS032E4F29E3LG

10AS032E4F29E3LG

Manufacturer No:

10AS032E4F29E3LG

Manufacturer:

Intel

Description:

IC SOC CORTEX-A9 1.5GHZ 780FBGA

Datasheet:

Datasheet

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10AS032E4F29E3LG Specifications

  • Type
    Parameter
  • Flash Size
    256KB
  • Architecture
    MCU, FPGA
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Arria 10 SX
The MPC8323VRADDCA is a specific model of integrated circuit chip manufactured by NXP Semiconductors. It belongs to the PowerQUICC II Pro family of processors and is designed for embedded networking and industrial applications. Here are some advantages and application scenarios of the MPC8323VRADDCA chip:Advantages: 1. High Performance: The MPC8323VRADDCA chip features a Power Architecture e300 core running at up to 333 MHz, providing sufficient processing power for demanding applications. 2. Integrated Peripherals: It includes various integrated peripherals such as Ethernet controllers, USB ports, UARTs, I2C, SPI, and more, reducing the need for additional external components. 3. Low Power Consumption: The chip is designed to be power-efficient, making it suitable for applications where power consumption is a concern. 4. Security Features: It incorporates security features like secure boot, tamper detection, and cryptographic acceleration, making it suitable for applications requiring secure communication and data protection. 5. Industrial Temperature Range: The MPC8323VRADDCA chip is designed to operate reliably in a wide temperature range, typically from -40°C to +105°C, making it suitable for industrial environments.Application Scenarios: 1. Networking Equipment: The MPC8323VRADDCA chip is commonly used in networking equipment such as routers, switches, gateways, and access points, where its high performance and integrated peripherals are beneficial. 2. Industrial Automation: It can be used in industrial automation applications like programmable logic controllers (PLCs), industrial control systems, and machine-to-machine communication, where its low power consumption and industrial temperature range are advantageous. 3. Embedded Systems: The chip can be utilized in various embedded systems, including smart meters, automotive electronics, medical devices, and other applications that require a combination of processing power, connectivity, and security. 4. Communication Infrastructure: The MPC8323VRADDCA chip can be employed in communication infrastructure equipment like base stations, small cells, and network gateways, where its performance and integrated peripherals are valuable. 5. Internet of Things (IoT): With its power efficiency and integrated connectivity options, the chip can be used in IoT devices and edge computing applications, enabling secure and efficient data processing and communication.It's important to note that the specific application scenarios may vary depending on the requirements and customization of the MPC8323VRADDCA chip by different manufacturers and developers.
10AS032E4F29E3LG Relevant information