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10AS032E4F29I3SG Specifications
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TypeParameter
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Flash Size256KB
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ArchitectureMCU, FPGA
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PackagingTray
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Product StatusActive
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SeriesArria 10 SX
The BCM47083SJ03 integrated circuit (IC) chips, developed by Broadcom, have several advantages and application scenarios. Some of them include:1. High Performance: The BCM47083SJ03 chips are designed to deliver high performance with a dual-core ARM Cortex-A9 processor running at up to 1.2 GHz. This makes them suitable for applications that require fast processing and data transfer speeds.2. Wireless Connectivity: These chips support multiple wireless connectivity options, including 802.11ac Wi-Fi, Bluetooth, and Zigbee. This makes them ideal for applications that require wireless communication, such as smart home devices, IoT applications, and wireless routers.3. Power Efficiency: The BCM47083SJ03 chips are designed to be power-efficient, enabling longer battery life for devices. This is particularly useful for battery-powered devices like smartwatches, fitness trackers, and portable devices.4. Security Features: These chips come with built-in security features, including hardware acceleration for encryption and decryption algorithms. This ensures secure data transmission and protection against potential security threats.5. Broad Application Scenarios: The BCM47083SJ03 chips find applications in various scenarios, including smart home automation, wireless routers, network storage devices, IoT gateways, and industrial automation. They can be used in devices that require high-speed wireless connectivity, processing power, and security features.Overall, the BCM47083SJ03 integrated circuit chips offer high performance, wireless connectivity, power efficiency, and security features, making them suitable for a wide range of applications in different industries.
10AS032E4F29I3SG Relevant information
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TA7S20-60GI
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