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10AS032E4F29E3SG

10AS032E4F29E3SG

Manufacturer No:

10AS032E4F29E3SG

Manufacturer:

Intel

Description:

IC SOC CORTEX-A9 1.5GHZ 780FBGA

Datasheet:

Datasheet

Delivery:

Payment:

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10AS032E4F29E3SG Specifications

  • Type
    Parameter
  • Flash Size
    256KB
  • Architecture
    MCU, FPGA
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Arria 10 SX
The BCM47083SA03 integrated circuit (IC) chips, developed by Broadcom, are specifically designed for wireless networking applications. Here are some advantages and application scenarios of these chips:Advantages: 1. High Performance: The BCM47083SA03 chips offer high-performance wireless connectivity, enabling faster data transfer rates and improved network efficiency. 2. Dual-Band Support: These chips support both 2.4 GHz and 5 GHz frequency bands, allowing for better network flexibility and reduced interference. 3. Advanced Security Features: The chips incorporate advanced security features like WPA3 encryption, ensuring secure and protected wireless connections. 4. Low Power Consumption: BCM47083SA03 chips are designed to be energy-efficient, consuming less power during operation, which is beneficial for battery-powered devices. 5. Cost-Effective Solution: These chips provide a cost-effective solution for wireless networking applications, making them suitable for a wide range of devices.Application Scenarios: 1. Home Wi-Fi Routers: The BCM47083SA03 chips can be used in home Wi-Fi routers, providing high-speed and reliable wireless connectivity for multiple devices. 2. Enterprise Wireless Access Points: These chips are suitable for enterprise-grade wireless access points, offering robust and secure wireless networks for businesses. 3. Internet of Things (IoT) Devices: BCM47083SA03 chips can be integrated into IoT devices, enabling wireless connectivity and communication between devices in smart homes, industrial automation, and other IoT applications. 4. Wireless Range Extenders: These chips can be used in wireless range extenders to enhance the coverage and range of existing Wi-Fi networks. 5. Smart TVs and Set-Top Boxes: BCM47083SA03 chips can be utilized in smart TVs and set-top boxes, enabling seamless streaming and connectivity features.Overall, the BCM47083SA03 integrated circuit chips provide high-performance wireless connectivity, advanced security features, and cost-effectiveness, making them suitable for various wireless networking applications.
10AS032E4F29E3SG Relevant information