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XCZU47DR-1FSVG1517E Specifications
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TypeParameter
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Flash Size256KB
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ArchitectureMCU, FPGA
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PackagingTray
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Product StatusActive
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SeriesZynq® UltraScale+™ RFSoC
The BCM58625BA0IF10G is a specific integrated circuit (IC) chip developed and produced by Broadcom. Unfortunately, specific details and comprehensive documentation about this particular chip could not be found. It is possible that this chip is an internal model number or a custom design created for a specific application or customer.Therefore, without further information or data sheets regarding its features, advantages, and application scenarios, it's challenging to provide a specific answer. It is advised to refer to official documentation, datasheets, or contact Broadcom directly for accurate details about the BCM58625BA0IF10G chip.
XCZU47DR-1FSVG1517E Relevant information
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TA7S20-60GI
Analog Devices Inc. -
QN9020/DY
Hittite -
CY8C21534-PVXE
Cypress Semiconductor Corp -
CY8C21434A24LTXIKC
Cypress Semiconductor Corp -
CY8C21534-12PVXET
Cypress Semiconductor Corp -
TA7S20-60GI
Analog Devices Inc. -
SAF3604EL/V3040AY
NXP USA Inc. -
SAF3604EL/V3040BY
NXP USA Inc. -
SAF3604EL/V3040BK
NXP USA Inc. -
SAF3604EL/V3040AK
NXP USA Inc.