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XCVM1802-2LLEVSVD1760

XCVM1802-2LLEVSVD1760

Manufacturer No:

XCVM1802-2LLEVSVD1760

Manufacturer:

AMD

Description:

IC VERSAL AICORE FPGA 1760BGA

Datasheet:

Datasheet

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XCVM1802-2LLEVSVD1760 Specifications

  • Type
    Parameter
  • Flash Size
    256KB
  • Architecture
    MPU, FPGA
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Versal™ Prime
The BCM47081SG03 integrated circuit chips, also known as system-on-a-chip (SoC) solutions, offer several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of BCM47081SG03 chips are:1. High Performance: The BCM47081SG03 chips are designed to deliver high performance with a dual-core ARM Cortex-A9 processor running at up to 1.4 GHz. This makes them suitable for applications that require fast processing and multitasking capabilities.2. Wireless Connectivity: These chips come with built-in Wi-Fi and Bluetooth capabilities, allowing seamless wireless connectivity. This makes them ideal for applications that require internet connectivity, such as smart home devices, IoT (Internet of Things) devices, and wireless routers.3. Multimedia Support: BCM47081SG03 chips feature a powerful graphics processing unit (GPU) that supports high-definition video decoding and encoding. This makes them suitable for multimedia applications like streaming devices, media players, and smart TVs.4. Security Features: These chips incorporate advanced security features like hardware acceleration for encryption and decryption, secure boot, and secure storage. This makes them suitable for applications that require secure data transmission and storage, such as network gateways and security systems.5. IoT Applications: The BCM47081SG03 chips are well-suited for IoT applications due to their low power consumption, wireless connectivity, and processing capabilities. They can be used in smart home automation systems, industrial IoT devices, and wearable technology.6. Network Infrastructure: These chips can be used in network infrastructure devices like routers, access points, and switches. Their high-performance processors and wireless connectivity enable efficient data routing and network management.7. Smart City Solutions: BCM47081SG03 chips can be applied in smart city solutions, such as intelligent transportation systems, smart lighting, and environmental monitoring. Their processing power and wireless connectivity enable real-time data collection and analysis for efficient city management.Overall, the BCM47081SG03 integrated circuit chips offer high performance, wireless connectivity, multimedia support, security features, and are suitable for a wide range of applications including smart home devices, IoT devices, multimedia devices, network infrastructure, and smart city solutions.
XCVM1802-2LLEVSVD1760 Relevant information