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XCZU19EG-3FFVD1760E

XCZU19EG-3FFVD1760E

Manufacturer No:

XCZU19EG-3FFVD1760E

Manufacturer:

AMD

Description:

IC SOC CORTEX-A53 1760FCBGA

Datasheet:

Datasheet

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XCZU19EG-3FFVD1760E Specifications

  • Type
    Parameter
  • Supplier Device Package
    1760-FCBGA (42.5x42.5)
  • Package / Case
    1760-BBGA, FCBGA
  • Operating Temperature
    0°C ~ 100°C (TJ)
  • Primary Attributes
    Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
  • Speed
    600MHz, 667MHz, 1.5GHz
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Peripherals
    DMA, WDT
  • RAM Size
    256KB
  • Flash Size
    -
  • Core Processor
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Architecture
    MCU, FPGA
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Zynq® UltraScale+™ MPSoC EG
The AU1250-700MGD integrated circuit (IC) chips have several advantages and application scenarios. Here are some of them:Advantages: 1. High Performance: The AU1250-700MGD chips are designed to deliver high performance with low power consumption. They are built on a high-performance ARM Cortex-A53 quad-core processor, which provides efficient processing capabilities.2. Low Power Consumption: These chips are optimized for low power consumption, making them suitable for battery-powered devices or applications where power efficiency is crucial.3. Rich Connectivity: The AU1250-700MGD chips offer a wide range of connectivity options, including Ethernet, USB, PCIe, and various serial interfaces. This makes them suitable for applications requiring connectivity to external devices or networks.4. Security Features: These chips come with built-in security features, such as secure boot, secure storage, and cryptographic acceleration. This ensures the protection of sensitive data and enhances the overall security of the system.5. Scalability: The AU1250-700MGD chips are highly scalable, allowing for customization and integration into various applications. They can be used in a wide range of devices, from IoT devices to industrial automation systems.Application Scenarios: 1. Internet of Things (IoT): The low power consumption and rich connectivity options make the AU1250-700MGD chips suitable for IoT applications. They can be used in smart home devices, wearables, and other IoT edge devices.2. Industrial Automation: These chips can be used in industrial automation systems, such as programmable logic controllers (PLCs) or human-machine interfaces (HMIs). The high performance and connectivity options enable efficient control and monitoring of industrial processes.3. Network Appliances: The AU1250-700MGD chips can be used in network appliances, such as routers, switches, or network attached storage (NAS) devices. The rich connectivity options and security features make them suitable for networking applications.4. Automotive: These chips can be utilized in automotive applications, such as infotainment systems, advanced driver-assistance systems (ADAS), or telematics. The high performance and security features are essential for automotive applications.5. Medical Devices: The AU1250-700MGD chips can be used in medical devices, such as patient monitoring systems or portable medical devices. The low power consumption and high performance are crucial for battery-powered medical devices.Overall, the AU1250-700MGD integrated circuit chips offer high performance, low power consumption, rich connectivity, and security features, making them suitable for a wide range of applications in various industries.
XCZU19EG-3FFVD1760E Relevant information