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XCVM1802-2LSEVSVA2197

XCVM1802-2LSEVSVA2197

Manufacturer No:

XCVM1802-2LSEVSVA2197

Manufacturer:

AMD

Description:

IC VERSAL AICORE FPGA 2197BGA

Datasheet:

Datasheet

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XCVM1802-2LSEVSVA2197 Specifications

  • Type
    Parameter
  • Flash Size
    256KB
  • Architecture
    MPU, FPGA
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Versal™ Prime
The 25PPC850CXEFP7012T integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips are designed to deliver high performance with a PowerPC architecture, offering fast processing speeds and efficient execution of instructions. 2. Low Power Consumption: The chips are optimized for low power consumption, making them suitable for battery-powered devices or applications where power efficiency is crucial. 3. Integrated Peripherals: The chips come with integrated peripherals such as UART, I2C, SPI, GPIO, and timers, reducing the need for additional external components and simplifying the overall system design. 4. Real-Time Capabilities: These chips are often used in real-time applications due to their ability to handle time-sensitive tasks and provide deterministic responses. 5. Industrial-Grade Reliability: The chips are designed to meet industrial-grade reliability standards, making them suitable for applications that require robustness and long-term operation.Application Scenarios: 1. Embedded Systems: The 25PPC850CXEFP7012T chips are commonly used in embedded systems, such as industrial automation, robotics, and automotive applications, where real-time processing, low power consumption, and reliability are essential. 2. Networking Equipment: These chips can be utilized in networking equipment like routers, switches, and gateways, where high-performance processing and low power consumption are required. 3. Internet of Things (IoT): With their low power consumption and integrated peripherals, these chips are suitable for IoT devices, including smart home devices, wearable technology, and sensor nodes. 4. Medical Devices: The chips can be used in medical devices that require real-time processing, low power consumption, and reliability, such as patient monitoring systems, medical imaging equipment, and diagnostic devices. 5. Aerospace and Defense: The high-performance capabilities and industrial-grade reliability of these chips make them suitable for aerospace and defense applications, including avionics systems, radar systems, and military communication equipment.It's important to note that the specific advantages and application scenarios may vary depending on the exact specifications and features of the 25PPC850CXEFP7012T integrated circuit chips.
XCVM1802-2LSEVSVA2197 Relevant information