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XCVM1802-2MLEVSVD1760

XCVM1802-2MLEVSVD1760

Manufacturer No:

XCVM1802-2MLEVSVD1760

Manufacturer:

AMD

Description:

IC VERSAL AICORE FPGA 1760BGA

Datasheet:

Datasheet

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XCVM1802-2MLEVSVD1760 Specifications

  • Type
    Parameter
  • Flash Size
    256KB
  • Architecture
    MPU, FPGA
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Versal™ Prime
The AU1350-667MBDA2 is a specific model of integrated circuit (IC) chip manufactured by Actions Semiconductor. While specific advantages and application scenarios may vary depending on the specific requirements and use cases, here are some general advantages and potential application scenarios for this chip:Advantages: 1. High Performance: The AU1350-667MBDA2 chip is designed to deliver high performance, making it suitable for demanding applications. 2. Low Power Consumption: It is optimized for low power consumption, making it suitable for battery-powered devices or applications where energy efficiency is crucial. 3. Rich Connectivity: The chip offers various connectivity options, including USB, Ethernet, and audio interfaces, enabling seamless integration with different devices and systems. 4. Multimedia Capabilities: It supports multimedia features like audio and video decoding, making it suitable for applications involving media playback or streaming. 5. Scalability: The chip is designed to be scalable, allowing for customization and adaptation to different requirements and specifications.Application Scenarios: 1. Smart Home Devices: The AU1350-667MBDA2 chip can be used in smart home devices like smart speakers, smart displays, or home automation systems, where it can handle multimedia processing, connectivity, and low power consumption. 2. Portable Media Players: Due to its multimedia capabilities and low power consumption, the chip can be used in portable media players, enabling high-quality audio and video playback on the go. 3. IoT Devices: The chip's connectivity options and low power consumption make it suitable for IoT devices, such as smart sensors, wearables, or connected appliances, where it can handle data processing and communication. 4. Industrial Applications: The high performance and scalability of the chip make it suitable for industrial applications like automation systems, control panels, or data acquisition devices, where it can handle complex tasks and interface with various peripherals. 5. Automotive Infotainment: The chip's multimedia capabilities and connectivity options make it suitable for automotive infotainment systems, enabling audio and video playback, connectivity with external devices, and integration with vehicle systems.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the project or product.
XCVM1802-2MLEVSVD1760 Relevant information