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XCZU11EG-3FFVC1760E

XCZU11EG-3FFVC1760E

Manufacturer No:

XCZU11EG-3FFVC1760E

Manufacturer:

AMD

Description:

IC SOC CORTEX-A53 1760FCBGA

Datasheet:

Datasheet

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XCZU11EG-3FFVC1760E Specifications

  • Type
    Parameter
  • Supplier Device Package
    1760-FCBGA (42.5x42.5)
  • Package / Case
    1760-BBGA, FCBGA
  • Operating Temperature
    0°C ~ 100°C (TJ)
  • Primary Attributes
    Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
  • Speed
    600MHz, 667MHz, 1.5GHz
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Peripherals
    DMA, WDT
  • RAM Size
    256KB
  • Flash Size
    -
  • Core Processor
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Architecture
    MCU, FPGA
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Zynq® UltraScale+™ MPSoC EG
The IBM25PPC750GXECR5522T integrated circuit chips, also known as PowerPC 750GX, have several advantages and application scenarios. Here are some of them:Advantages: 1. High Performance: The PowerPC 750GX chips are designed to deliver high performance with clock speeds up to 1.6 GHz. They have a superscalar architecture with multiple execution units, allowing for efficient processing of instructions.2. Low Power Consumption: These chips are power-efficient, making them suitable for applications where power consumption is a concern. They have power management features that enable dynamic power scaling based on workload requirements.3. Embedded Applications: The PowerPC 750GX chips are commonly used in embedded systems and applications. They offer a balance between performance and power consumption, making them suitable for various embedded applications such as networking equipment, industrial control systems, and automotive electronics.4. Rugged Design: These chips are designed to withstand harsh environments and operate reliably in industrial settings. They have features like extended temperature range, high shock resistance, and low susceptibility to electromagnetic interference.Application Scenarios: 1. Networking Equipment: The PowerPC 750GX chips are widely used in networking equipment such as routers, switches, and network appliances. Their high performance and low power consumption make them suitable for handling network traffic and running network protocols.2. Industrial Control Systems: These chips find applications in industrial control systems, including programmable logic controllers (PLCs), robotics, and automation systems. Their rugged design and real-time processing capabilities make them suitable for controlling and monitoring industrial processes.3. Automotive Electronics: The PowerPC 750GX chips are used in automotive electronics for applications like engine control units (ECUs), infotainment systems, and advanced driver-assistance systems (ADAS). Their high performance and reliability are crucial for automotive applications.4. Aerospace and Defense: These chips are also used in aerospace and defense applications, including avionics systems, radar systems, and military-grade embedded computing. Their ruggedness, high performance, and low power consumption make them suitable for these demanding environments.Overall, the IBM25PPC750GXECR5522T integrated circuit chips offer a combination of high performance, low power consumption, and ruggedness, making them suitable for various embedded applications in networking, industrial control, automotive, aerospace, and defense sectors.
XCZU11EG-3FFVC1760E Relevant information