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XCZU17EG-3FFVB1517E

XCZU17EG-3FFVB1517E

Manufacturer No:

XCZU17EG-3FFVB1517E

Manufacturer:

AMD

Description:

IC SOC CORTEX-A53 1517FCBGA

Datasheet:

Datasheet

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XCZU17EG-3FFVB1517E Specifications

  • Type
    Parameter
  • Supplier Device Package
    1517-FCBGA (40x40)
  • Package / Case
    1517-BBGA, FCBGA
  • Operating Temperature
    0°C ~ 100°C (TJ)
  • Primary Attributes
    Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
  • Speed
    600MHz, 667MHz, 1.5GHz
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Peripherals
    DMA, WDT
  • RAM Size
    256KB
  • Flash Size
    -
  • Core Processor
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Architecture
    MCU, FPGA
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Zynq® UltraScale+™ MPSoC EG
The OMAPL138EZCEA3R is an integrated circuit chip developed by Texas Instruments. It is a highly versatile and powerful chip that offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the OMAPL138EZCEA3R chip are:1. Dual-core Architecture: The chip features a dual-core ARM Cortex-A8 processor and a C674x DSP (Digital Signal Processor) core. This combination allows for efficient processing of both general-purpose tasks and real-time signal processing applications.2. High Performance: With clock speeds up to 456 MHz for the ARM core and 456 MHz for the DSP core, the OMAPL138EZCEA3R chip provides high-performance computing capabilities. It can handle complex algorithms and data-intensive tasks efficiently.3. Low Power Consumption: Despite its high performance, the chip is designed to be power-efficient. It incorporates power management techniques to optimize power consumption, making it suitable for battery-powered devices and applications where power efficiency is crucial.4. Connectivity Options: The chip offers various connectivity options, including Ethernet, USB, UART, SPI, I2C, and more. This makes it suitable for applications that require communication with other devices or networks.5. Multimedia Capabilities: The OMAPL138EZCEA3R chip includes a rich set of multimedia peripherals, such as video and audio codecs, image and video processing accelerators, and interfaces for cameras and displays. This makes it ideal for multimedia applications like video surveillance, multimedia players, and video conferencing systems.6. Real-time Signal Processing: The integrated DSP core of the chip enables real-time signal processing capabilities. It can be used in applications such as audio processing, speech recognition, image processing, and industrial automation that require real-time data processing and analysis.7. Industrial and Automotive Applications: The OMAPL138EZCEA3R chip is designed to meet the requirements of industrial and automotive applications. It can be used in industrial control systems, motor control, robotics, automotive infotainment systems, and more.8. Development Support: Texas Instruments provides comprehensive development tools, software libraries, and support for the OMAPL138EZCEA3R chip. This makes it easier for developers to design and develop applications using the chip.Overall, the OMAPL138EZCEA3R chip offers a powerful and flexible platform for a wide range of applications, including multimedia, real-time signal processing, industrial control, and automotive systems. Its high performance, low power consumption, and connectivity options make it a popular choice for developers working on advanced embedded systems.
XCZU17EG-3FFVB1517E Relevant information