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XCZU17EG-L2FFVC1760E

XCZU17EG-L2FFVC1760E

Manufacturer No:

XCZU17EG-L2FFVC1760E

Manufacturer:

AMD

Description:

IC SOC CORTEX-A53 1760FCBGA

Datasheet:

Datasheet

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XCZU17EG-L2FFVC1760E Specifications

  • Type
    Parameter
  • Supplier Device Package
    1760-FCBGA (42.5x42.5)
  • Package / Case
    1760-BBGA, FCBGA
  • Operating Temperature
    0°C ~ 100°C (TJ)
  • Primary Attributes
    Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
  • Speed
    533MHz, 600MHz, 1.3GHz
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Peripherals
    DMA, WDT
  • RAM Size
    256KB
  • Flash Size
    -
  • Core Processor
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Architecture
    MCU, FPGA
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Zynq® UltraScale+™ MPSoC EG
The MPC8306SCVMABDCA is a highly integrated system-on-chip (SoC) designed by NXP Semiconductors. It belongs to the PowerQUICC II Pro family and offers several advantages and application scenarios:Advantages: 1. High Performance: The MPC8306SCVMABDCA chip is built on a Power Architecture core, providing high processing power and performance. 2. Integrated Peripherals: It includes various integrated peripherals such as Ethernet controllers, USB ports, UARTs, I2C, SPI, and GPIOs, reducing the need for additional external components. 3. Low Power Consumption: The chip is designed to be power-efficient, making it suitable for applications where power consumption is a concern. 4. Security Features: It incorporates security features like secure boot, tamper detection, and cryptographic acceleration, making it suitable for applications requiring secure communication and data protection. 5. Industrial Temperature Range: The chip is designed to operate reliably in industrial temperature ranges, making it suitable for harsh environments.Application Scenarios: 1. Networking Equipment: The MPC8306SCVMABDCA chip is commonly used in networking equipment such as routers, switches, gateways, and access points. Its high performance and integrated Ethernet controllers make it suitable for these applications. 2. Industrial Automation: The chip's industrial temperature range and integrated peripherals make it suitable for industrial automation applications. It can be used in programmable logic controllers (PLCs), motor control systems, and other industrial control systems. 3. Internet of Things (IoT): With its low power consumption and integrated peripherals, the chip can be used in IoT devices such as smart meters, home automation systems, and sensor nodes. 4. Communication Systems: The chip's high performance and security features make it suitable for communication systems like IP phones, VoIP gateways, and media servers. 5. Embedded Systems: The MPC8306SCVMABDCA chip can be used in various embedded systems that require a combination of processing power, connectivity, and security, such as digital signage, kiosks, and automotive infotainment systems.Overall, the MPC8306SCVMABDCA chip offers a balance of performance, integration, and security, making it suitable for a wide range of applications in networking, industrial automation, IoT, communication, and embedded systems.
XCZU17EG-L2FFVC1760E Relevant information