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XCZU17EG-1FFVD1760I Specifications
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TypeParameter
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Supplier Device Package1760-FCBGA (42.5x42.5)
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Package / Case1760-BBGA, FCBGA
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Operating Temperature-40°C ~ 100°C (TJ)
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Primary AttributesZynq®UltraScale+™ FPGA, 926K+ Logic Cells
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Speed500MHz, 600MHz, 1.2GHz
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ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
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PeripheralsDMA, WDT
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RAM Size256KB
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Flash Size-
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Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
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ArchitectureMCU, FPGA
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PackagingTray
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Product StatusActive
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SeriesZynq® UltraScale+™ MPSoC EG
The MPC8360VVAGDGA is a highly integrated system-on-chip (SoC) designed by NXP Semiconductors. It belongs to the PowerQUICC II Pro family and offers several advantages and application scenarios:Advantages: 1. High Performance: The MPC8360VVAGDGA chip is built on a Power Architecture core, providing high processing power and performance. 2. Integrated Features: It integrates various peripherals and interfaces, including Ethernet, USB, PCI, UART, I2C, SPI, and more, reducing the need for additional external components. 3. Security Features: The chip includes security features like secure boot, tamper detection, and cryptographic acceleration, making it suitable for applications requiring data protection. 4. Low Power Consumption: The MPC8360VVAGDGA chip is designed to be power-efficient, making it suitable for applications where power consumption is a concern. 5. Scalability: It offers scalability options, allowing for customization and flexibility in different application scenarios.Application Scenarios: 1. Networking Equipment: The MPC8360VVAGDGA chip is commonly used in networking equipment such as routers, switches, and gateways. Its high-performance processing capabilities and integrated networking interfaces make it suitable for these applications. 2. Industrial Automation: The chip's robust features, including various communication interfaces and security capabilities, make it suitable for industrial automation applications. It can be used in programmable logic controllers (PLCs), industrial gateways, and other automation systems. 3. Telecommunications: The MPC8360VVAGDGA chip can be used in telecommunications equipment like base stations, media gateways, and voice-over-IP (VoIP) systems. Its high-performance processing and integrated interfaces enable efficient data processing and communication. 4. Embedded Systems: The chip's integration of various peripherals and low power consumption make it suitable for embedded systems applications. It can be used in embedded devices like digital signage, kiosks, and automotive infotainment systems. 5. Security Systems: The MPC8360VVAGDGA chip's security features, including secure boot and cryptographic acceleration, make it suitable for security systems like surveillance cameras, access control systems, and network security appliances.Overall, the MPC8360VVAGDGA chip offers high performance, integration, and security features, making it suitable for a wide range of applications in networking, industrial automation, telecommunications, embedded systems, and security systems.
XCZU17EG-1FFVD1760I Relevant information
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TA7S20-60GI
Analog Devices Inc. -
QN9020/DY
Hittite -
CY8C21534-PVXE
Cypress Semiconductor Corp -
CY8C21434A24LTXIKC
Cypress Semiconductor Corp -
CY8C21534-12PVXET
Cypress Semiconductor Corp -
TA7S20-60GI
Analog Devices Inc. -
SAF3604EL/V3040AY
NXP USA Inc. -
SAF3604EL/V3040BY
NXP USA Inc. -
SAF3604EL/V3040BK
NXP USA Inc. -
SAF3604EL/V3040AK
NXP USA Inc.