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XCZU7EG-3FFVF1517E

XCZU7EG-3FFVF1517E

Manufacturer No:

XCZU7EG-3FFVF1517E

Manufacturer:

AMD

Description:

IC SOC CORTEX-A53 1517FCBGA

Datasheet:

Datasheet

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XCZU7EG-3FFVF1517E Specifications

  • Type
    Parameter
  • Supplier Device Package
    1517-FCBGA (40x40)
  • Package / Case
    1517-BBGA, FCBGA
  • Operating Temperature
    0°C ~ 100°C (TJ)
  • Primary Attributes
    Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
  • Speed
    600MHz, 667MHz, 1.5GHz
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Peripherals
    DMA, WDT
  • RAM Size
    256KB
  • Flash Size
    -
  • Core Processor
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Architecture
    MCU, FPGA
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Zynq® UltraScale+™ MPSoC EG
The MAX396EWI+ is an integrated circuit (IC) chip developed by Maxim Integrated. It belongs to the MAX396 series, which are high-speed, low-power, quad, low-voltage differential signaling (LVDS) line receivers. Here are some advantages and application scenarios of the MAX396EWI+ IC chips:Advantages: 1. High-speed data transmission: The MAX396EWI+ chips support LVDS signaling at speeds up to 600Mbps, making them suitable for applications that require fast data transfer rates. 2. Low power consumption: These chips are designed to consume minimal power, making them energy efficient and suitable for battery-powered applications. 3. Small form factor: The MAX396EWI+ chips are available in a tiny 16-pin SOIC package, which allows for compact circuit designs and saves board space. 4. Robust performance: These chips are designed with built-in protection against common mode transients and electrostatic discharge (ESD), ensuring reliable operation even in challenging environments. 5. Wide temperature range: The MAX396EWI+ chips can operate in an extended temperature range of -40°C to +85°C, making them suitable for various industrial and automotive applications.Application scenarios: 1. High-speed data communication: The MAX396EWI+ IC chips can be used in data communication systems that require high-speed transmission, such as gigabit Ethernet, Fibre Channel, and high-speed data links. 2. Industrial automation: These chips can be utilized in industrial automation applications where data needs to be transmitted over long distances between sensors, actuators, and control units. 3. Automotive electronics: The MAX396EWI+ chips find applications in automotive electronics, such as infotainment systems, where they enable high-speed data transmission with low power consumption. 4. Medical devices: These chips can be integrated into medical equipment that requires high-speed data transfer, like patient monitoring systems, imaging devices, or electronic health record systems. 5. Test and measurement equipment: The MAX396EWI+ chips are well-suited for test and measurement applications where accurate and high-speed data acquisition is necessary, for instance, oscilloscopes, data loggers, or signal generators.These advantages and application scenarios demonstrate the versatility and usefulness of MAX396EWI+ IC chips in various domains where high-speed data transmission, low power consumption, and robust performance are crucial.
XCZU7EG-3FFVF1517E Relevant information