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XCZU15EG-L1FFVC900I

XCZU15EG-L1FFVC900I

Manufacturer No:

XCZU15EG-L1FFVC900I

Manufacturer:

AMD

Description:

IC SOC CORTEX-A53 900FCBGA

Datasheet:

Datasheet

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XCZU15EG-L1FFVC900I Specifications

  • Type
    Parameter
  • Supplier Device Package
    900-FCBGA (31x31)
  • Package / Case
    900-BBGA, FCBGA
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Primary Attributes
    Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
  • Speed
    500MHz, 600MHz, 1.2GHz
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Peripherals
    DMA, WDT
  • RAM Size
    256KB
  • Flash Size
    -
  • Core Processor
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Architecture
    MCU, FPGA
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Zynq® UltraScale+™ MPSoC EG
The MAX383ESE+ is a high-speed, low-power, differential line driver integrated circuit (IC) chip. It offers several advantages and can be used in various application scenarios. Some of the advantages and application scenarios of the MAX383ESE+ are:Advantages: 1. High-Speed Data Transmission: The MAX383ESE+ is designed to operate at high speeds, making it suitable for applications that require fast data transmission rates. 2. Low Power Consumption: This IC chip is designed to consume low power, making it energy-efficient and suitable for battery-powered devices or applications where power consumption is a concern. 3. Differential Line Driver: The MAX383ESE+ is a differential line driver, which means it can transmit data over differential lines, providing better noise immunity and signal integrity. 4. Wide Supply Voltage Range: It operates over a wide supply voltage range, typically from 4.5V to 5.5V, allowing flexibility in different power supply configurations. 5. Small Package: The MAX383ESE+ is available in a small package, making it suitable for space-constrained applications.Application Scenarios: 1. High-Speed Data Communication: The MAX383ESE+ can be used in applications that require high-speed data communication, such as Ethernet, USB, or other serial communication interfaces. 2. Industrial Automation: It can be used in industrial automation systems where fast and reliable data transmission is required, such as in control systems or data acquisition systems. 3. Telecommunications: The MAX383ESE+ can be used in telecommunications equipment, such as routers, switches, or modems, to transmit data over long distances with high-speed and low power consumption. 4. Automotive Electronics: It can be used in automotive electronics applications, such as in-vehicle networks or infotainment systems, where high-speed data transmission and low power consumption are essential. 5. Medical Devices: The MAX383ESE+ can be used in medical devices that require high-speed data transmission, such as patient monitoring systems or medical imaging equipment.These are just a few examples of the advantages and application scenarios of the MAX383ESE+ IC chip. Its versatility, high-speed capabilities, low power consumption, and small package make it suitable for a wide range of applications that require reliable and fast data transmission.
XCZU15EG-L1FFVC900I Relevant information