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XCZU7EG-2FFVF1517I Specifications
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TypeParameter
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Supplier Device Package1517-FCBGA (40x40)
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Package / Case1517-BBGA, FCBGA
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Operating Temperature-40°C ~ 100°C (TJ)
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Primary AttributesZynq®UltraScale+™ FPGA, 504K+ Logic Cells
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Speed533MHz, 600MHz, 1.3GHz
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ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
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PeripheralsDMA, WDT
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RAM Size256KB
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Flash Size-
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Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
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ArchitectureMCU, FPGA
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PackagingTray
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Product StatusActive
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SeriesZynq® UltraScale+™ MPSoC EG
The R8A77210C133BAV is an integrated circuit chip developed by Renesas Electronics Corporation. It is a system-on-chip (SoC) designed for automotive applications. Here are some advantages and application scenarios of this chip:Advantages: 1. High Performance: The R8A77210C133BAV chip offers high processing power and performance, making it suitable for demanding automotive applications. 2. Integrated Functionality: It integrates various components and functions into a single chip, reducing the need for external components and simplifying the overall system design. 3. Automotive-Grade Reliability: This chip is designed to meet the stringent requirements of the automotive industry, ensuring high reliability and durability in harsh operating conditions. 4. Low Power Consumption: The R8A77210C133BAV chip is optimized for low power consumption, making it suitable for automotive applications where energy efficiency is crucial.Application Scenarios: 1. In-Vehicle Infotainment (IVI) Systems: The R8A77210C133BAV chip can be used in IVI systems to provide multimedia capabilities, including audio/video playback, navigation, connectivity, and user interface. 2. Advanced Driver Assistance Systems (ADAS): This chip can be utilized in ADAS applications to process sensor data, perform real-time object detection, and enable features like lane departure warning, collision avoidance, and adaptive cruise control. 3. Automotive Gateway: The R8A77210C133BAV chip can act as a gateway in automotive networks, facilitating communication between various subsystems and protocols, such as CAN, Ethernet, and LIN. 4. Telematics: It can be employed in telematics systems to enable vehicle tracking, remote diagnostics, over-the-air updates, and connectivity with external services.Overall, the R8A77210C133BAV chip offers high performance, integration, reliability, and low power consumption, making it suitable for a wide range of automotive applications.
XCZU7EG-2FFVF1517I Relevant information
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TA7S20-60GI
Analog Devices Inc. -
QN9020/DY
Hittite -
CY8C21534-PVXE
Cypress Semiconductor Corp -
CY8C21434A24LTXIKC
Cypress Semiconductor Corp -
CY8C21534-12PVXET
Cypress Semiconductor Corp -
TA7S20-60GI
Analog Devices Inc. -
SAF3604EL/V3040AY
NXP USA Inc. -
SAF3604EL/V3040BY
NXP USA Inc. -
SAF3604EL/V3040BK
NXP USA Inc. -
SAF3604EL/V3040AK
NXP USA Inc.