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XCZU9EG-1FFVB1156I

XCZU9EG-1FFVB1156I

Manufacturer No:

XCZU9EG-1FFVB1156I

Manufacturer:

AMD

Description:

IC SOC CORTEX-A53 1156FCBGA

Datasheet:

Datasheet

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XCZU9EG-1FFVB1156I Specifications

  • Type
    Parameter
  • Supplier Device Package
    1156-FCBGA (35x35)
  • Package / Case
    1156-BBGA, FCBGA
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Primary Attributes
    Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
  • Speed
    500MHz, 600MHz, 1.2GHz
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Peripherals
    DMA, WDT
  • RAM Size
    256KB
  • Flash Size
    -
  • Core Processor
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Architecture
    MCU, FPGA
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Zynq® UltraScale+™ MPSoC EG
The SAM9X60-V/DWB integrated circuit chips offer several advantages and can be applied in various scenarios. Some of the advantages and application scenarios are:Advantages: 1. High Performance: The SAM9X60-V/DWB chips are based on a high-performance 32-bit ARM Cortex-A5 processor, providing efficient processing power for demanding applications. 2. Connectivity: These chips offer a wide range of connectivity options, including Ethernet, USB, CAN, and various serial interfaces, enabling seamless integration with other devices and systems. 3. Security Features: The SAM9X60-V/DWB chips come with built-in security features such as secure boot, secure key storage, and hardware encryption, ensuring data integrity and protection against unauthorized access. 4. Low Power Consumption: These chips are designed to operate with low power consumption, making them suitable for battery-powered or energy-efficient devices. 5. Rich Peripherals: The SAM9X60-V/DWB chips provide a rich set of peripherals, including LCD controllers, touch controllers, audio interfaces, and more, enabling the development of feature-rich applications.Application Scenarios: 1. Industrial Automation: The SAM9X60-V/DWB chips can be used in industrial automation systems, such as programmable logic controllers (PLCs), to provide high-performance processing, connectivity, and security features. 2. Internet of Things (IoT): These chips are suitable for IoT applications, where they can be used in edge devices to enable connectivity, data processing, and secure communication with cloud services. 3. Human-Machine Interface (HMI): The SAM9X60-V/DWB chips can be utilized in HMI applications, such as smart displays or control panels, to provide a responsive user interface, connectivity options, and multimedia capabilities. 4. Automotive: These chips can be applied in automotive systems, such as infotainment systems or advanced driver-assistance systems (ADAS), to enable multimedia processing, connectivity, and secure communication. 5. Medical Devices: The SAM9X60-V/DWB chips can be used in medical devices, such as patient monitoring systems or portable diagnostic devices, to provide high-performance processing, connectivity, and security features.Overall, the SAM9X60-V/DWB integrated circuit chips offer a combination of performance, connectivity, security, and low power consumption, making them suitable for a wide range of applications in various industries.
XCZU9EG-1FFVB1156I Relevant information