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XCZU15EG-1FFVC900E

XCZU15EG-1FFVC900E

Manufacturer No:

XCZU15EG-1FFVC900E

Manufacturer:

AMD

Description:

IC SOC CORTEX-A53 900FCBGA

Datasheet:

Datasheet

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XCZU15EG-1FFVC900E Specifications

  • Type
    Parameter
  • Supplier Device Package
    900-FCBGA (31x31)
  • Package / Case
    900-BBGA, FCBGA
  • Operating Temperature
    0°C ~ 100°C (TJ)
  • Primary Attributes
    Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
  • Speed
    500MHz, 600MHz, 1.2GHz
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Peripherals
    DMA, WDT
  • RAM Size
    256KB
  • Flash Size
    -
  • Core Processor
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Architecture
    MCU, FPGA
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Zynq® UltraScale+™ MPSoC EG
The R8A77440HA02BG#UA integrated circuit (IC) chip, also known as the Renesas R-Car H3A, is a highly advanced and powerful system-on-a-chip (SoC) designed for automotive applications. Here are some of its advantages and application scenarios:Advantages: 1. High Performance: The R8A77440HA02BG#UA chip is based on a quad-core ARM Cortex-A57 processor architecture, providing high computing power for demanding automotive applications. 2. Graphics Capabilities: It features a PowerVR GX6650 graphics processing unit (GPU), enabling advanced graphics rendering and support for multiple displays. 3. Multimedia Support: The chip includes dedicated hardware accelerators for video and audio processing, allowing for smooth multimedia playback and processing. 4. Connectivity: It offers various connectivity options, including Ethernet, USB, CAN, and HDMI, facilitating seamless integration with other automotive systems and external devices. 5. Safety and Security: The R8A77440HA02BG#UA chip incorporates safety features like hardware virtualization, secure boot, and secure memory, ensuring robust security and safety in automotive systems.Application Scenarios: 1. In-Vehicle Infotainment (IVI) Systems: The R8A77440HA02BG#UA chip is commonly used in IVI systems, providing advanced multimedia capabilities, including audio/video playback, navigation, connectivity, and user interface. 2. Advanced Driver Assistance Systems (ADAS): The chip's high computing power and graphics capabilities make it suitable for ADAS applications like surround-view cameras, lane departure warning, collision avoidance, and object detection. 3. Digital Cockpits: With its powerful processing capabilities and support for multiple displays, the chip can be used in digital cockpit systems, offering rich and interactive user interfaces, instrument clusters, and heads-up displays. 4. Autonomous Driving: The R8A77440HA02BG#UA chip can be utilized in autonomous driving systems, enabling real-time processing of sensor data, decision-making algorithms, and control of various vehicle functions. 5. Telematics: It can be employed in telematics systems, providing connectivity, data processing, and communication capabilities for services like remote diagnostics, vehicle tracking, and over-the-air updates.Overall, the R8A77440HA02BG#UA integrated circuit chip offers high performance, advanced graphics, multimedia support, connectivity, and safety features, making it suitable for a wide range of automotive applications.
XCZU15EG-1FFVC900E Relevant information