XCZU6EG-2FFVC900I

XCZU6EG-2FFVC900I

Manufacturer No:

XCZU6EG-2FFVC900I

Manufacturer:

AMD

Description:

IC SOC CORTEX-A53 900FCBGA

Datasheet:

Datasheet

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XCZU6EG-2FFVC900I Specifications

  • Type
    Parameter
  • Supplier Device Package
    900-FCBGA (31x31)
  • Package / Case
    900-BBGA, FCBGA
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Primary Attributes
    Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
  • Speed
    533MHz, 600MHz, 1.3GHz
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Peripherals
    DMA, WDT
  • RAM Size
    256KB
  • Flash Size
    -
  • Core Processor
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Architecture
    MCU, FPGA
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Zynq® UltraScale+™ MPSoC EG
The XLP308LXD1200-20 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: The XLP308LXD1200-20 chips offer high-performance computing capabilities, making them suitable for demanding applications. 2. Low Power Consumption: These chips are designed to operate with low power consumption, making them energy-efficient and suitable for battery-powered devices. 3. Compact Size: The XLP308LXD1200-20 chips are compact in size, allowing for easy integration into various electronic devices. 4. Versatility: These chips are versatile and can be used in a wide range of applications, making them suitable for different industries and use cases. 5. Reliability: The XLP308LXD1200-20 chips are designed to be reliable and provide stable performance over extended periods.Application Scenarios: 1. Internet of Things (IoT): The XLP308LXD1200-20 chips can be used in IoT devices, such as smart home appliances, wearables, and industrial sensors, due to their low power consumption and compact size. 2. Embedded Systems: These chips can be used in embedded systems, such as automotive electronics, industrial automation, and robotics, to provide high-performance computing capabilities in a small form factor. 3. Consumer Electronics: The XLP308LXD1200-20 chips can be used in various consumer electronic devices, including smartphones, tablets, and gaming consoles, to enhance their processing power and energy efficiency. 4. Medical Devices: These chips can be utilized in medical devices, such as patient monitoring systems, medical imaging equipment, and diagnostic devices, to enable high-performance computing and reliable operation. 5. Communication Systems: The XLP308LXD1200-20 chips can be employed in communication systems, such as routers, switches, and network appliances, to handle high data throughput and ensure efficient network operations.Overall, the XLP308LXD1200-20 integrated circuit chips offer high performance, low power consumption, and compact size, making them suitable for a wide range of applications in IoT, embedded systems, consumer electronics, medical devices, and communication systems.