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XCZU6EG-2FFVC900I Specifications
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TypeParameter
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Supplier Device Package900-FCBGA (31x31)
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Package / Case900-BBGA, FCBGA
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Operating Temperature-40°C ~ 100°C (TJ)
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Primary AttributesZynq®UltraScale+™ FPGA, 469K+ Logic Cells
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Speed533MHz, 600MHz, 1.3GHz
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ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
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PeripheralsDMA, WDT
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RAM Size256KB
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Flash Size-
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Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
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ArchitectureMCU, FPGA
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PackagingTray
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Product StatusActive
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SeriesZynq® UltraScale+™ MPSoC EG
The XLP308LXD1200-20 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: The XLP308LXD1200-20 chips offer high-performance computing capabilities, making them suitable for demanding applications. 2. Low Power Consumption: These chips are designed to operate with low power consumption, making them energy-efficient and suitable for battery-powered devices. 3. Compact Size: The XLP308LXD1200-20 chips are compact in size, allowing for easy integration into various electronic devices. 4. Versatility: These chips are versatile and can be used in a wide range of applications, making them suitable for different industries and use cases. 5. Reliability: The XLP308LXD1200-20 chips are designed to be reliable and provide stable performance over extended periods.Application Scenarios: 1. Internet of Things (IoT): The XLP308LXD1200-20 chips can be used in IoT devices, such as smart home appliances, wearables, and industrial sensors, due to their low power consumption and compact size. 2. Embedded Systems: These chips can be used in embedded systems, such as automotive electronics, industrial automation, and robotics, to provide high-performance computing capabilities in a small form factor. 3. Consumer Electronics: The XLP308LXD1200-20 chips can be used in various consumer electronic devices, including smartphones, tablets, and gaming consoles, to enhance their processing power and energy efficiency. 4. Medical Devices: These chips can be utilized in medical devices, such as patient monitoring systems, medical imaging equipment, and diagnostic devices, to enable high-performance computing and reliable operation. 5. Communication Systems: The XLP308LXD1200-20 chips can be employed in communication systems, such as routers, switches, and network appliances, to handle high data throughput and ensure efficient network operations.Overall, the XLP308LXD1200-20 integrated circuit chips offer high performance, low power consumption, and compact size, making them suitable for a wide range of applications in IoT, embedded systems, consumer electronics, medical devices, and communication systems.
XCZU6EG-2FFVC900I Relevant information
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TA7S20-60GI
Analog Devices Inc. -
QN9020/DY
Hittite -
CY8C21534-PVXE
Cypress Semiconductor Corp -
CY8C21434A24LTXIKC
Cypress Semiconductor Corp -
CY8C21534-12PVXET
Cypress Semiconductor Corp -
TA7S20-60GI
Analog Devices Inc. -
SAF3604EL/V3040AY
NXP USA Inc. -
SAF3604EL/V3040BY
NXP USA Inc. -
SAF3604EL/V3040BK
NXP USA Inc. -
SAF3604EL/V3040AK
NXP USA Inc.