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XCZU5EV-2FBVB900I

XCZU5EV-2FBVB900I

Manufacturer No:

XCZU5EV-2FBVB900I

Manufacturer:

AMD

Description:

IC SOC CORTEX-A53 900FCBGA

Datasheet:

Datasheet

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XCZU5EV-2FBVB900I Specifications

  • Type
    Parameter
  • Supplier Device Package
    900-FCBGA (31x31)
  • Package / Case
    900-BBGA, FCBGA
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Primary Attributes
    Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
  • Speed
    533MHz, 600MHz, 1.3GHz
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Peripherals
    DMA, WDT
  • RAM Size
    256KB
  • Flash Size
    -
  • Core Processor
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Architecture
    MCU, FPGA
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Zynq® UltraScale+™ MPSoC EV
The XLP208B0IFSB00120G integrated circuit chips have several advantages and application scenarios:Advantages: 1. Low Power Consumption: These chips are designed to operate at low power levels, making them suitable for battery-powered devices and energy-efficient applications. 2. High Performance: Despite their low power consumption, these chips offer high performance capabilities, enabling them to handle complex tasks and data processing efficiently. 3. Integrated Features: The XLP208B0IFSB00120G chips come with various integrated features such as analog-to-digital converters, digital-to-analog converters, timers, and communication interfaces, reducing the need for external components and simplifying the overall design. 4. Small Form Factor: These chips are compact in size, making them suitable for applications with space constraints or where miniaturization is required. 5. Cost-Effective: The integration of multiple features and low power consumption make these chips cost-effective, as they reduce the need for additional components and lower overall system costs.Application Scenarios: 1. Internet of Things (IoT) Devices: The low power consumption and integrated features of these chips make them ideal for IoT devices such as smart sensors, wearable devices, and home automation systems. 2. Portable Electronics: The small form factor and low power consumption make these chips suitable for portable electronics like smartphones, tablets, and portable medical devices. 3. Industrial Automation: The high performance and integrated features of these chips make them suitable for industrial automation applications such as control systems, motor drives, and robotics. 4. Automotive Electronics: The low power consumption and compact size of these chips make them suitable for automotive electronics applications such as infotainment systems, advanced driver-assistance systems (ADAS), and engine control units. 5. Consumer Electronics: These chips can be used in various consumer electronics applications such as gaming consoles, digital cameras, and audio/video equipment, where low power consumption and high performance are desired.Overall, the XLP208B0IFSB00120G integrated circuit chips offer a combination of low power consumption, high performance, integrated features, and small form factor, making them suitable for a wide range of applications in various industries.
XCZU5EV-2FBVB900I Relevant information