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XAZU7EV-1FBVB900I

XAZU7EV-1FBVB900I

Manufacturer No:

XAZU7EV-1FBVB900I

Manufacturer:

AMD

Description:

IC SOC CORTEX-A53 900FCBGA

Datasheet:

Datasheet

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XAZU7EV-1FBVB900I Specifications

  • Type
    Parameter
  • Supplier Device Package
    900-FCBGA (31x31)
  • Package / Case
    900-BBGA, FCBGA
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Primary Attributes
    Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
  • Speed
    500MHz, 600MHz, 1.2GHz
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Peripherals
    DMA, WDT
  • RAM Size
    256KB
  • Flash Size
    -
  • Core Processor
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Architecture
    MCU, FPGA
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Zynq® UltraScale+™ MPSoC EV
The XLP101B1KFSB00050G integrated circuit chips have several advantages and application scenarios:Advantages: 1. Low power consumption: These chips are designed to operate at low power levels, making them suitable for battery-powered devices and energy-efficient applications. 2. High performance: The XLP101B1KFSB00050G chips offer high processing power and performance, enabling them to handle complex tasks and calculations efficiently. 3. Small form factor: These chips are compact in size, making them suitable for applications where space is limited. 4. Integrated features: The chips come with various integrated features such as memory, communication interfaces, and peripherals, reducing the need for external components and simplifying the overall design. 5. Cost-effective: The XLP101B1KFSB00050G chips provide a cost-effective solution for many applications, offering a balance between performance and price.Application scenarios: 1. Internet of Things (IoT): These chips can be used in IoT devices such as smart home appliances, wearable devices, and industrial sensors, where low power consumption and high performance are crucial. 2. Consumer electronics: The XLP101B1KFSB00050G chips can be utilized in smartphones, tablets, and other portable devices, providing efficient processing power while extending battery life. 3. Industrial automation: These chips can be employed in industrial control systems, robotics, and automation equipment, where high performance and reliability are required. 4. Medical devices: The chips can be used in medical devices such as patient monitoring systems, portable diagnostic tools, and implantable devices, where low power consumption and compact size are essential. 5. Automotive electronics: The XLP101B1KFSB00050G chips can be utilized in automotive applications like infotainment systems, advanced driver-assistance systems (ADAS), and engine control units (ECUs), providing efficient processing and connectivity capabilities.It is important to note that the specific advantages and application scenarios may vary depending on the exact specifications and capabilities of the XLP101B1KFSB00050G integrated circuit chips.
XAZU7EV-1FBVB900I Relevant information