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XCZU9EG-1FFVB1156E

XCZU9EG-1FFVB1156E

Manufacturer No:

XCZU9EG-1FFVB1156E

Manufacturer:

AMD

Description:

IC SOC CORTEX-A53 1156FCBGA

Datasheet:

Datasheet

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XCZU9EG-1FFVB1156E Specifications

  • Type
    Parameter
  • Supplier Device Package
    1156-FCBGA (35x35)
  • Package / Case
    1156-BBGA, FCBGA
  • Operating Temperature
    0°C ~ 100°C (TJ)
  • Primary Attributes
    Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
  • Speed
    500MHz, 600MHz, 1.2GHz
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Peripherals
    DMA, WDT
  • RAM Size
    256KB
  • Flash Size
    -
  • Core Processor
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Architecture
    MCU, FPGA
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Zynq® UltraScale+™ MPSoC EG
The BCM58622BA0KF12G is a specific model of integrated circuit (IC) chip manufactured by Broadcom. While specific advantages and application scenarios may vary depending on the specific requirements and use cases, here are some general advantages and potential application scenarios for the BCM58622BA0KF12G:Advantages: 1. High Performance: The BCM58622BA0KF12G is designed to deliver high-performance networking capabilities, making it suitable for demanding applications. 2. Integration: This chip integrates multiple functions and features into a single package, reducing the need for additional components and simplifying the overall design. 3. Power Efficiency: Broadcom's IC chips are known for their power efficiency, helping to reduce energy consumption and heat generation. 4. Scalability: The BCM58622BA0KF12G is designed to be scalable, allowing for flexible deployment in various network environments. 5. Reliability: Broadcom is a reputable manufacturer known for producing reliable and high-quality IC chips.Application Scenarios: 1. Data Centers: The BCM58622BA0KF12G can be used in data centers to provide high-speed networking capabilities, enabling efficient data transfer and communication between servers, storage systems, and other network devices. 2. Enterprise Networks: This chip can be utilized in enterprise networks to support high-performance networking requirements, such as routing, switching, and security functions. 3. Telecommunications: The BCM58622BA0KF12G can be employed in telecommunications infrastructure, including routers, switches, and gateways, to enable high-speed data transmission and network connectivity. 4. Cloud Computing: With its high-performance capabilities, the chip can be used in cloud computing environments to handle large-scale data processing, virtualization, and network management tasks. 5. Internet of Things (IoT): The BCM58622BA0KF12G can be integrated into IoT devices and gateways to provide networking capabilities, enabling connectivity and communication between IoT devices and the cloud.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and use cases of the particular system or network where the BCM58622BA0KF12G chip is being utilized.
XCZU9EG-1FFVB1156E Relevant information