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XCZU5EV-L1FBVB900I

XCZU5EV-L1FBVB900I

Manufacturer No:

XCZU5EV-L1FBVB900I

Manufacturer:

AMD

Description:

IC SOC CORTEX-A53 900FCBGA

Datasheet:

Datasheet

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XCZU5EV-L1FBVB900I Specifications

  • Type
    Parameter
  • Supplier Device Package
    900-FCBGA (31x31)
  • Package / Case
    900-BBGA, FCBGA
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Primary Attributes
    Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
  • Speed
    500MHz, 600MHz, 1.2GHz
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Peripherals
    DMA, WDT
  • RAM Size
    256KB
  • Flash Size
    -
  • Core Processor
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Architecture
    MCU, FPGA
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Zynq® UltraScale+™ MPSoC EV
The BCM47093SA03 integrated circuit chips, developed by Broadcom, offer several advantages and find application in various scenarios. Some of the advantages and application scenarios of these chips are:Advantages: 1. High Performance: The BCM47093SA03 chips are designed to deliver high performance with a dual-core ARM Cortex-A9 processor running at up to 1.4 GHz. This enables efficient processing of data and faster execution of tasks.2. Wireless Connectivity: These chips support multiple wireless connectivity options, including 802.11ac Wi-Fi, Bluetooth, and Zigbee. This allows for seamless wireless communication and integration with various devices and networks.3. Power Efficiency: The chips are designed to be power-efficient, enabling longer battery life for devices. This is particularly useful in scenarios where low power consumption is crucial, such as in IoT devices or battery-powered applications.4. Security Features: The BCM47093SA03 chips incorporate advanced security features, including hardware acceleration for encryption and decryption, secure boot, and secure storage. This ensures data privacy and protection against potential security threats.Application Scenarios: 1. Smart Home Automation: The chips can be used in smart home automation systems to enable wireless connectivity and control of various devices, such as smart lights, thermostats, security cameras, and door locks. The high performance and wireless capabilities of the chips facilitate seamless communication and integration within the smart home ecosystem.2. Internet of Things (IoT) Devices: The BCM47093SA03 chips are suitable for IoT devices that require wireless connectivity and processing capabilities. These chips can be used in applications such as smart appliances, wearables, industrial monitoring systems, and environmental sensors.3. Wireless Routers and Gateways: The high-performance processing and wireless connectivity options make these chips ideal for use in wireless routers and gateways. They can handle high-speed data transmission, support multiple devices, and provide secure and reliable connectivity.4. Multimedia Streaming Devices: The BCM47093SA03 chips can be utilized in multimedia streaming devices, such as set-top boxes or media players. The high-performance processors enable smooth streaming of high-definition content, while the wireless connectivity options allow for easy integration with other devices and networks.Overall, the BCM47093SA03 integrated circuit chips offer high performance, wireless connectivity, power efficiency, and security features, making them suitable for a wide range of applications in smart homes, IoT devices, wireless routers, and multimedia streaming devices.
XCZU5EV-L1FBVB900I Relevant information