Home / System On Chip (SoC) / XCZU5EV-2FBVB900E/
XCZU5EV-2FBVB900E

XCZU5EV-2FBVB900E

Manufacturer No:

XCZU5EV-2FBVB900E

Manufacturer:

AMD

Description:

IC SOC CORTEX-A53 900FCBGA

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

XCZU5EV-2FBVB900E Specifications

  • Type
    Parameter
  • Supplier Device Package
    900-FCBGA (31x31)
  • Package / Case
    900-BBGA, FCBGA
  • Operating Temperature
    0°C ~ 100°C (TJ)
  • Primary Attributes
    Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
  • Speed
    533MHz, 600MHz, 1.3GHz
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Peripherals
    DMA, WDT
  • RAM Size
    256KB
  • Flash Size
    -
  • Core Processor
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Architecture
    MCU, FPGA
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Zynq® UltraScale+™ MPSoC EV
The BCM47083SL01 integrated circuit (IC) chip, developed by Broadcom, is specifically designed for wireless networking applications. Some of the advantages and application scenarios of this chip are:1. High Performance: The BCM47083SL01 chip offers high-performance capabilities, including a powerful 1.2 GHz dual-core processor and advanced Wi-Fi technology. This enables it to handle demanding networking tasks efficiently.2. Dual-Band Wi-Fi: The chip supports both 2.4 GHz and 5 GHz frequency bands, allowing for simultaneous dual-band operation. This enables faster and more reliable wireless connections, especially in crowded environments.3. Gigabit Ethernet: The chip includes multiple Gigabit Ethernet ports, providing high-speed wired connectivity options. This is useful for connecting devices that require a stable and high-bandwidth connection, such as gaming consoles or media servers.4. IoT and Smart Home Applications: The BCM47083SL01 chip is well-suited for Internet of Things (IoT) and smart home applications. Its high-performance capabilities and dual-band Wi-Fi support enable seamless connectivity for a wide range of IoT devices, such as smart thermostats, security cameras, or home automation systems.5. Mesh Networking: The chip supports mesh networking, allowing for the creation of robust and scalable wireless networks. This is particularly useful in large homes or office spaces where a single Wi-Fi router may not provide sufficient coverage. Mesh networking ensures a consistent and reliable connection throughout the entire network.6. Enterprise and Small Business Networking: The BCM47083SL01 chip is suitable for enterprise and small business networking solutions. Its high-performance processor and Gigabit Ethernet ports enable efficient data handling and fast wired connections, making it ideal for office environments with multiple users and devices.7. Wireless Access Points and Routers: The chip can be used in the development of wireless access points and routers. Its advanced Wi-Fi technology, dual-band support, and mesh networking capabilities make it a reliable choice for creating high-performance and scalable wireless networks.Overall, the BCM47083SL01 chip offers a range of advantages and is well-suited for various wireless networking applications, including IoT, smart home, enterprise networking, and wireless access points.
XCZU5EV-2FBVB900E Relevant information