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XC7Z045-L2FFG900I

XC7Z045-L2FFG900I

Manufacturer No:

XC7Z045-L2FFG900I

Manufacturer:

AMD

Description:

IC SOC CORTEX-A9 800MHZ 900FCBGA

Datasheet:

Datasheet

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XC7Z045-L2FFG900I Specifications

  • Type
    Parameter
  • Flash Size
    256KB
  • Architecture
    MCU, FPGA
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Zynq®-7000
The MPC8541PXAPF557 is a specific model of the PowerQUICC III integrated circuit chip developed by NXP Semiconductors. This chip is designed for networking and communication applications and offers several advantages and application scenarios:1. High Performance: The MPC8541PXAPF557 chip is built on the Power Architecture technology and offers a high-performance processing core. It features a 1.0 GHz e500 PowerPC core, which enables it to handle complex networking tasks efficiently.2. Networking Capabilities: This chip is specifically designed for networking applications and offers various networking features. It includes integrated Ethernet controllers, supporting multiple Gigabit Ethernet ports, which makes it suitable for routers, switches, and other network equipment.3. Security Features: The MPC8541PXAPF557 chip incorporates security features like a security engine and encryption/decryption accelerators. These features enable secure communication and data transfer, making it suitable for applications that require high levels of security, such as VPN gateways or firewalls.4. Scalability: The PowerQUICC III family of chips, including the MPC8541PXAPF557, is designed to be scalable. This means that it can be used in a range of applications, from small embedded systems to high-performance networking devices. The chip's architecture allows for easy integration with other components and expansion of functionality.5. Industrial Applications: The MPC8541PXAPF557 chip is suitable for various industrial applications that require reliable and high-performance networking capabilities. It can be used in industrial automation, smart grid systems, transportation systems, and other applications that require robust networking and communication capabilities.6. Telecommunication Infrastructure: The chip's high-performance processing core and networking features make it suitable for telecommunication infrastructure applications. It can be used in base stations, media gateways, and other telecommunication equipment that requires fast data processing and networking capabilities.Overall, the MPC8541PXAPF557 chip offers high performance, networking capabilities, security features, scalability, and is suitable for various industrial and telecommunication applications.
XC7Z045-L2FFG900I Relevant information