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XCZU5EG-1FBVB900I

XCZU5EG-1FBVB900I

Manufacturer No:

XCZU5EG-1FBVB900I

Manufacturer:

AMD

Description:

IC SOC CORTEX-A53 900FCBGA

Datasheet:

Datasheet

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XCZU5EG-1FBVB900I Specifications

  • Type
    Parameter
  • Supplier Device Package
    900-FCBGA (31x31)
  • Package / Case
    900-BBGA, FCBGA
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Primary Attributes
    Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
  • Speed
    500MHz, 600MHz, 1.2GHz
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Peripherals
    DMA, WDT
  • RAM Size
    256KB
  • Flash Size
    -
  • Core Processor
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Architecture
    MCU, FPGA
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Zynq® UltraScale+™ MPSoC EG
The R8A774E1HA01BN#G0 is an integrated circuit chip developed by Renesas Electronics Corporation. It is a system-on-chip (SoC) designed for automotive applications. Here are some advantages and application scenarios of this chip:Advantages: 1. High Performance: The R8A774E1HA01BN#G0 chip is built on a powerful ARM Cortex-A53 quad-core processor, providing high processing capabilities for demanding automotive applications. 2. Graphics and Multimedia Support: It features a PowerVR Series8XE GPU, enabling advanced graphics rendering and multimedia processing, which is essential for automotive infotainment systems. 3. Connectivity: The chip supports various connectivity options, including Ethernet, CAN, USB, and HDMI, allowing seamless integration with other automotive systems and external devices. 4. Safety and Reliability: It is designed to meet the stringent safety and reliability requirements of the automotive industry, ensuring stable and secure operation in harsh environments. 5. Low Power Consumption: The chip incorporates power-saving technologies, optimizing energy efficiency and reducing power consumption, which is crucial for automotive applications.Application Scenarios: 1. Automotive Infotainment Systems: The R8A774E1HA01BN#G0 chip can be used in automotive infotainment systems to provide advanced multimedia capabilities, including audio/video playback, navigation, connectivity, and user interface. 2. Advanced Driver Assistance Systems (ADAS): It can be utilized in ADAS applications, such as collision avoidance, lane departure warning, and adaptive cruise control, where high-performance processing and connectivity are required. 3. Instrument Clusters: The chip can power instrument clusters in vehicles, offering high-resolution graphics, real-time data processing, and connectivity for displaying critical information to the driver. 4. Telematics: It can be employed in automotive telematics systems, enabling features like vehicle tracking, remote diagnostics, emergency services, and over-the-air updates. 5. In-Vehicle Networking: The chip's connectivity options make it suitable for in-vehicle networking applications, facilitating communication between various automotive systems, such as the engine control unit, body control module, and sensors.Overall, the R8A774E1HA01BN#G0 chip's high performance, graphics support, connectivity, safety features, and low power consumption make it a versatile solution for a wide range of automotive applications.
XCZU5EG-1FBVB900I Relevant information