XCZU7EG-1FBVB900E

XCZU7EG-1FBVB900E

Manufacturer No:

XCZU7EG-1FBVB900E

Manufacturer:

AMD

Description:

IC SOC CORTEX-A53 900FCBGA

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

XCZU7EG-1FBVB900E Specifications

  • Type
    Parameter
  • Supplier Device Package
    900-FCBGA (31x31)
  • Package / Case
    900-BBGA, FCBGA
  • Operating Temperature
    0°C ~ 100°C (TJ)
  • Primary Attributes
    Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
  • Speed
    500MHz, 600MHz, 1.2GHz
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Peripherals
    DMA, WDT
  • RAM Size
    256KB
  • Flash Size
    -
  • Core Processor
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Architecture
    MCU, FPGA
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Zynq® UltraScale+™ MPSoC EG
The MCIMX6DP5EYM1AB is an integrated circuit chip from NXP Semiconductors. It is part of the i.MX 6DualPlus family of applications processors, which are designed for high-performance multimedia applications. Here are some advantages and application scenarios of the MCIMX6DP5EYM1AB:Advantages: 1. High Performance: The MCIMX6DP5EYM1AB features a dual-core ARM Cortex-A9 processor running at up to 1.2 GHz, providing high processing power for demanding applications. 2. Multimedia Capabilities: It includes a Vivante GC2000 3D graphics engine, enabling advanced graphics rendering and multimedia processing. 3. Connectivity Options: The chip supports various connectivity options, including Ethernet, USB, PCIe, and multiple display interfaces like HDMI, LVDS, and MIPI-DSI. 4. Low Power Consumption: The i.MX 6DualPlus family is designed for low power consumption, making it suitable for battery-powered devices or applications with strict power requirements. 5. Industrial-Grade Reliability: The MCIMX6DP5EYM1AB is designed for industrial applications, offering high reliability and extended temperature range support.Application Scenarios: 1. Automotive Infotainment Systems: The MCIMX6DP5EYM1AB can be used in automotive infotainment systems to provide high-performance multimedia capabilities, support for multiple displays, and connectivity options for various peripherals. 2. Industrial Automation: The chip's industrial-grade reliability and low power consumption make it suitable for industrial automation applications, such as human-machine interfaces (HMIs), control systems, and industrial IoT devices. 3. Medical Devices: The high processing power and multimedia capabilities of the MCIMX6DP5EYM1AB can be utilized in medical devices like portable ultrasound machines, patient monitoring systems, or medical imaging devices. 4. Smart Home Automation: The chip can be used in smart home automation systems to enable multimedia streaming, connectivity with various smart devices, and advanced user interfaces. 5. Portable Devices: The low power consumption and high performance of the MCIMX6DP5EYM1AB make it suitable for portable devices like tablets, e-readers, or handheld gaming consoles.These are just a few examples of the advantages and application scenarios of the MCIMX6DP5EYM1AB. The chip's versatility and capabilities make it suitable for a wide range of multimedia and high-performance applications.