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XCZU4EV-2FBVB900I

XCZU4EV-2FBVB900I

Manufacturer No:

XCZU4EV-2FBVB900I

Manufacturer:

AMD

Description:

IC SOC CORTEX-A53 900FCBGA

Datasheet:

Datasheet

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XCZU4EV-2FBVB900I Specifications

  • Type
    Parameter
  • Supplier Device Package
    900-FCBGA (31x31)
  • Package / Case
    900-BBGA, FCBGA
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Primary Attributes
    Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
  • Speed
    533MHz, 600MHz, 1.3GHz
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Peripherals
    DMA, WDT
  • RAM Size
    256KB
  • Flash Size
    -
  • Core Processor
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Architecture
    MCU, FPGA
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Zynq® UltraScale+™ MPSoC EV
The OMAPL132EZWT2 integrated circuit chips, also known as the OMAP-L132, are a type of microcontroller unit (MCU) developed by Texas Instruments. These chips offer several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of OMAPL132EZWT2 chips are:Advantages: 1. Low power consumption: The OMAPL132EZWT2 chips are designed to operate at low power levels, making them suitable for battery-powered devices and energy-efficient applications. 2. High performance: These chips feature a 32-bit ARM Cortex-M3 processor, which provides high processing power and performance for demanding applications. 3. Integrated peripherals: OMAPL132EZWT2 chips come with a wide range of integrated peripherals, including analog-to-digital converters (ADCs), digital-to-analog converters (DACs), timers, UARTs, SPI, I2C, and more. This integration simplifies the design process and reduces the need for external components. 4. Rich connectivity options: The chips support various communication interfaces like USB, Ethernet, CAN, and LIN, enabling seamless connectivity with other devices and networks. 5. Flexible memory options: OMAPL132EZWT2 chips offer different memory configurations, including flash memory and RAM, allowing developers to choose the appropriate memory size for their applications.Application Scenarios: 1. Internet of Things (IoT): The low power consumption, integrated peripherals, and connectivity options make OMAPL132EZWT2 chips suitable for IoT applications. They can be used in smart home devices, wearable technology, industrial automation, and other IoT-enabled systems. 2. Consumer Electronics: These chips can be utilized in various consumer electronics products, such as smartwatches, fitness trackers, remote controls, and home automation systems. 3. Industrial Control Systems: OMAPL132EZWT2 chips are well-suited for industrial control applications, including motor control, process automation, and monitoring systems. The high performance and integrated peripherals enable efficient control and monitoring of industrial processes. 4. Medical Devices: The low power consumption and integrated analog peripherals make OMAPL132EZWT2 chips suitable for medical devices like patient monitoring systems, portable medical instruments, and health monitoring wearables. 5. Automotive: These chips can be used in automotive applications, such as vehicle control units, infotainment systems, and advanced driver-assistance systems (ADAS). The rich connectivity options and high performance enable seamless integration with automotive networks and subsystems.Overall, OMAPL132EZWT2 chips offer a combination of low power consumption, high performance, integrated peripherals, and connectivity options, making them suitable for a wide range of applications in IoT, consumer electronics, industrial control, medical devices, and automotive sectors.
XCZU4EV-2FBVB900I Relevant information