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XC7Z045-3FBG676E

XC7Z045-3FBG676E

Manufacturer No:

XC7Z045-3FBG676E

Manufacturer:

AMD

Description:

IC SOC CORTEX-A9 1GHZ 676FCBGA

Datasheet:

Datasheet

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Payment:

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XC7Z045-3FBG676E Specifications

  • Type
    Parameter
  • Flash Size
    256KB
  • Architecture
    MCU, FPGA
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Zynq®-7000
The XLP308XD1200-21 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: The XLP308XD1200-21 chips offer high-performance computing capabilities, making them suitable for demanding applications. 2. Low Power Consumption: These chips are designed to operate at low power, making them energy-efficient and suitable for battery-powered devices. 3. Integrated Features: The chips integrate various features such as memory, peripherals, and communication interfaces, reducing the need for external components and simplifying the overall system design. 4. Scalability: The XLP308XD1200-21 chips are scalable, allowing for easy integration into different applications and accommodating varying performance requirements. 5. Reliability: These chips are designed to be reliable and robust, ensuring stable operation even in harsh environments.Application Scenarios: 1. Internet of Things (IoT): The XLP308XD1200-21 chips can be used in IoT devices such as smart home automation systems, wearable devices, and industrial sensors, where low power consumption and high performance are crucial. 2. Embedded Systems: These chips are suitable for embedded systems in various industries, including automotive, aerospace, and healthcare, where reliability, scalability, and high performance are required. 3. Consumer Electronics: The XLP308XD1200-21 chips can be used in consumer electronics devices such as smartphones, tablets, and gaming consoles, providing efficient processing power and extended battery life. 4. Industrial Automation: These chips can be utilized in industrial automation systems, including robotics, machine vision, and control systems, where high-performance computing and reliability are essential. 5. Communication Systems: The XLP308XD1200-21 chips can be integrated into communication systems such as routers, switches, and network appliances, offering high-speed processing and low power consumption.Overall, the XLP308XD1200-21 integrated circuit chips are versatile and can be applied in various domains that require high performance, low power consumption, and reliability.
XC7Z045-3FBG676E Relevant information