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XCZU4EV-2FBVB900E

XCZU4EV-2FBVB900E

Manufacturer No:

XCZU4EV-2FBVB900E

Manufacturer:

AMD

Description:

IC SOC CORTEX-A53 900FCBGA

Datasheet:

Datasheet

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XCZU4EV-2FBVB900E Specifications

  • Type
    Parameter
  • Supplier Device Package
    900-FCBGA (31x31)
  • Package / Case
    900-BBGA, FCBGA
  • Operating Temperature
    0°C ~ 100°C (TJ)
  • Primary Attributes
    Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
  • Speed
    533MHz, 600MHz, 1.3GHz
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Peripherals
    DMA, WDT
  • RAM Size
    256KB
  • Flash Size
    -
  • Core Processor
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Architecture
    MCU, FPGA
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Zynq® UltraScale+™ MPSoC EV
The XLP308HXD1200-22 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips are designed to deliver high performance with low power consumption, making them suitable for power-sensitive applications. 2. Integrated Features: They integrate multiple functions and features into a single chip, reducing the need for external components and simplifying the overall system design. 3. Wide Operating Voltage Range: These chips can operate over a wide voltage range, making them suitable for various power supply configurations. 4. Robustness: They are designed to withstand harsh environmental conditions, making them suitable for industrial applications. 5. Cost-Effective: The integration of multiple functions into a single chip reduces the overall system cost.Application Scenarios: 1. Power Management Systems: These chips can be used in power management systems to regulate and control the power supply, ensuring efficient power distribution and consumption. 2. Industrial Automation: They can be used in industrial automation systems to control and monitor various processes, such as motor control, sensor interfacing, and communication. 3. Renewable Energy Systems: These chips can be used in renewable energy systems, such as solar power systems, to manage and optimize the power generated from renewable sources. 4. Automotive Electronics: They can be used in automotive electronics for various applications, including engine control, powertrain management, and safety systems. 5. Consumer Electronics: These chips can be used in consumer electronics devices, such as smartphones, tablets, and wearable devices, to provide efficient power management and control.Overall, the XLP308HXD1200-22 integrated circuit chips offer high performance, integration, and versatility, making them suitable for a wide range of applications in various industries.
XCZU4EV-2FBVB900E Relevant information