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XC7Z045-1FFG676I

XC7Z045-1FFG676I

Manufacturer No:

XC7Z045-1FFG676I

Manufacturer:

AMD

Description:

IC SOC CORTEX-A9 667MHZ 676FCBGA

Datasheet:

Datasheet

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XC7Z045-1FFG676I Specifications

  • Type
    Parameter
  • Flash Size
    256KB
  • Architecture
    MCU, FPGA
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Zynq®-7000
The XLP208B1IFSB00100G integrated circuit chips have several advantages and application scenarios:Advantages: 1. Low Power Consumption: These chips are designed to operate at low power levels, making them suitable for battery-powered devices and energy-efficient applications. 2. High Performance: Despite their low power consumption, these chips offer high performance capabilities, enabling them to handle complex tasks and data processing efficiently. 3. Integrated Features: The XLP208B1IFSB00100G chips come with various integrated features such as analog-to-digital converters (ADCs), digital-to-analog converters (DACs), timers, and communication interfaces, reducing the need for external components and simplifying the overall design. 4. Small Form Factor: These chips are compact in size, making them suitable for applications with space constraints or where miniaturization is required. 5. Cost-Effective: The integration of multiple features and high performance in a single chip reduces the overall system cost, making it an economical choice for various applications.Application Scenarios: 1. Internet of Things (IoT) Devices: The low power consumption and integrated features of these chips make them ideal for IoT devices such as smart sensors, wearable devices, and connected appliances. 2. Industrial Automation: The high performance and integrated communication interfaces of these chips make them suitable for industrial automation applications, including control systems, motor drives, and monitoring devices. 3. Consumer Electronics: These chips can be used in various consumer electronics applications such as smartphones, tablets, portable media players, and gaming consoles, where low power consumption and high performance are essential. 4. Medical Devices: The small form factor and low power consumption of these chips make them suitable for medical devices such as wearable health monitors, implantable devices, and portable medical equipment. 5. Automotive Electronics: The high performance and integrated features of these chips make them suitable for automotive applications such as engine control units, infotainment systems, and advanced driver-assistance systems (ADAS).Overall, the XLP208B1IFSB00100G integrated circuit chips offer low power consumption, high performance, integrated features, and small form factor, making them versatile for a wide range of applications in various industries.
XC7Z045-1FFG676I Relevant information