XCZU4EG-1FBVB900I

XCZU4EG-1FBVB900I

Manufacturer No:

XCZU4EG-1FBVB900I

Manufacturer:

AMD

Description:

IC SOC CORTEX-A53 900FCBGA

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

XCZU4EG-1FBVB900I Specifications

  • Type
    Parameter
  • Supplier Device Package
    900-FCBGA (31x31)
  • Package / Case
    900-BBGA, FCBGA
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Primary Attributes
    Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
  • Speed
    500MHz, 600MHz, 1.2GHz
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Peripherals
    DMA, WDT
  • RAM Size
    256KB
  • Flash Size
    -
  • Core Processor
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Architecture
    MCU, FPGA
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Zynq® UltraScale+™ MPSoC EG
The OMAP3525ECUSA integrated circuit (IC) chips, developed by Texas Instruments, have several advantages and application scenarios. Some of them include:1. High Performance: The OMAP3525ECUSA chips are designed to deliver high performance with a powerful ARM Cortex-A8 processor running at up to 600 MHz. This makes them suitable for applications that require fast processing and multitasking capabilities.2. Low Power Consumption: These chips are optimized for low power consumption, making them ideal for battery-powered devices such as smartphones, tablets, and portable media players. The power management features help extend the battery life of these devices.3. Multimedia Capabilities: The OMAP3525ECUSA chips come with integrated multimedia accelerators, including a dedicated graphics engine and video accelerators. This enables high-quality video playback, 3D graphics rendering, and support for various multimedia formats.4. Connectivity Options: These chips offer a range of connectivity options, including USB, Ethernet, and various wireless protocols such as Wi-Fi and Bluetooth. This makes them suitable for applications that require seamless connectivity and data transfer.5. Application Scenarios: The OMAP3525ECUSA chips find applications in various fields, including: a. Mobile Devices: These chips are commonly used in smartphones, tablets, and e-readers, providing the necessary processing power and multimedia capabilities. b. Automotive: The OMAP3525ECUSA chips can be used in automotive infotainment systems, providing high-quality multimedia playback, connectivity, and navigation features. c. Industrial Control: These chips can be utilized in industrial control systems, offering high-performance processing and connectivity for automation and monitoring applications. d. Medical Devices: The OMAP3525ECUSA chips can be integrated into medical devices such as portable ultrasound machines or patient monitoring systems, enabling real-time processing and connectivity. e. Consumer Electronics: These chips can be used in various consumer electronics devices, including portable media players, gaming consoles, and digital cameras, providing multimedia capabilities and connectivity options.Overall, the OMAP3525ECUSA chips offer a combination of high performance, low power consumption, multimedia capabilities, and connectivity options, making them suitable for a wide range of applications in different industries.