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XCZU5EG-1SFVC784E

XCZU5EG-1SFVC784E

Manufacturer No:

XCZU5EG-1SFVC784E

Manufacturer:

AMD

Description:

IC SOC CORTEX-A53 784FCBGA

Datasheet:

Datasheet

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XCZU5EG-1SFVC784E Specifications

  • Type
    Parameter
  • Supplier Device Package
    784-FCBGA (23x23)
  • Package / Case
    784-BFBGA, FCBGA
  • Operating Temperature
    0°C ~ 100°C (TJ)
  • Primary Attributes
    Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
  • Speed
    500MHz, 600MHz, 1.2GHz
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Peripherals
    DMA, WDT
  • RAM Size
    256KB
  • Flash Size
    -
  • Core Processor
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Architecture
    MCU, FPGA
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Zynq® UltraScale+™ MPSoC EG
The MPC8313ECVRADDC is a specific model of the PowerQUICC II Pro integrated circuit chip developed by NXP Semiconductors. This chip is designed for embedded networking and industrial applications. Here are some advantages and application scenarios of the MPC8313ECVRADDC:Advantages: 1. High Performance: The MPC8313ECVRADDC chip is built on a Power Architecture core, providing high processing power and performance for demanding applications. 2. Integrated Features: It includes various integrated features such as Ethernet controllers, USB ports, UARTs, I2C, SPI, and more, reducing the need for additional external components. 3. Low Power Consumption: The chip is designed to be power-efficient, making it suitable for applications where power consumption is a concern. 4. Security Features: It offers hardware security features like secure boot, tamper detection, and cryptographic acceleration, ensuring data integrity and protection. 5. Industrial Temperature Range: The MPC8313ECVRADDC chip is designed to operate reliably in a wide temperature range, making it suitable for industrial applications.Application Scenarios: 1. Networking Equipment: The MPC8313ECVRADDC chip is commonly used in networking equipment such as routers, switches, gateways, and access points, where high-performance processing and integrated networking features are required. 2. Industrial Automation: It can be used in industrial automation systems for tasks like control and monitoring, where the chip's low power consumption, integrated features, and industrial temperature range are advantageous. 3. Embedded Systems: The chip is suitable for various embedded systems, including automotive applications, smart meters, surveillance systems, and more, where a combination of processing power, connectivity, and security features is needed. 4. Communication Infrastructure: It can be utilized in communication infrastructure equipment like base stations, small cells, and wireless access points, where high-performance processing and networking capabilities are essential. 5. Internet of Things (IoT): The MPC8313ECVRADDC chip can be used in IoT devices that require connectivity, processing power, and security features, enabling them to communicate and interact with other devices or cloud services.It's important to note that the specific application scenarios may vary depending on the requirements and customization of the overall system design.
XCZU5EG-1SFVC784E Relevant information